Influence of silver content on fatigue life and failure mechanism of lead-free solder joints under drop conditions - Details

Author：

Yang, Jin-Li (Yang, Jin-Li.) | Lei, Yong-Ping (Lei, Yong-Ping.) (Scholars：雷永平) | Lin, Jian (Lin, Jian.) | Xiao, Hui (Xiao, Hui.)

Indexed by：

EI PKU CSCD

Abstract：

Drop　tests　were　carried　out　with　three　kinds　of　materials　(Sn-3.0Ag-0.5Cu,　Sn-1.0Ag-0.5Cu　and　Sn-0.3Ag-0.7Cu),　respectively.　Half-sine　acceleration　loads　was　applied　in　the　experiment,　the　peak　value　of　half　sine　acceleration　and　pulse　duration　were　3200g　and　1ms.　The　failure　position　of　solder　joint　was　identified　and　analyzed　using　electrical　test,　optical　microscope,　scanning　electron　microscope.　The　results　show　that　most　of　the　failures　joints　for　the　three　kinds　of　materials　locate　at　the　printed　circuit　board　(PCB)　side.　The　solder　joints　at　four　outermost　corners　fail　at　first.　And　the　failure　modes　of　Sn-3.0Ag-0.5Cu　and　Sn-1.0Ag-0.5Cu　were　all　brittle　fractures,　while　the　Sn-0.3Ag-0.7Cu　is　brittle-ductile　fracture.　The　thickness　of　intermetallic　compound(IMC)　gradually　decreases　and　the　life　of　solder　joint　enhances　with　the　reduction　of　Ag　content.

Keyword：

Printed circuit boards Ductile fracture Drops Silver alloys Lead-free solders Soldered joints Ternary alloys Copper alloys Fatigue of materials Silver Tin alloys Scanning electron microscopy

Author Community：

[ 1 ] [Yang, Jin-Li]College of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China
[ 2 ] [Lei, Yong-Ping]College of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China
[ 3 ] [Lei, Yong-Ping]State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China
[ 4 ] [Lin, Jian]College of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China
[ 5 ] [Xiao, Hui]College of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China