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Author:

Pan, Shijie (Pan, Shijie.) | Zhu, Hui (Zhu, Hui.) | Feng, Shiwei (Feng, Shiwei.) | Yang, Yang (Yang, Yang.) | Xu, Chao (Xu, Chao.) | Huo, Shuai (Huo, Shuai.) | Lu, Xiaozhuang (Lu, Xiaozhuang.) | Zhang, Yamin (Zhang, Yamin.) | Bai, Kun (Bai, Kun.)

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EI Scopus

Abstract:

The trapping behaviors in the carbon nanotube field-effect transistor (CNTFET) pose a major challenge to the operation stability. Herein, a trap characterization system based on the transient drain current is constructed to realize the comprehensive measurement and analysis of trap levels in the CNTFET with SiO2 as the gate oxide. A Bayesian deconvolution function is developed to optimize the trap extraction accuracy based on the measured transient current, and three electron traps and three hole traps are identified under the positive and negative gate stress, respectively. Leveraging this model, a comprehensive experimental and theoretical analysis of the trap information, including the time constant, exact amplitude, and energy levels, can be conducted. In particular, the charge trapping mechanisms under different gate and drain biases are studied based on the dependence of trap amplitudes on filling voltages. Through these advances, we analyze the physical origin and specific location of each trap and compare the trap properties against a wide range of trap levels reported in previous studies. The approach used in this study can be potentially beneficial to better understand the trap levels responsible for the hysteresis issues and optimize the performance and reliability of the CNTFET. © 1963-2012 IEEE.

Keyword:

Transient analysis Charge trapping Electromagnetic transients Hole traps Carbon nanotube field effect transistors

Author Community:

  • [ 1 ] [Pan, Shijie]Beijing University of Technology, Institute of Semiconductor Device Reliability Physics, Beijing; 100124, China
  • [ 2 ] [Zhu, Hui]Beijing University of Technology, Institute of Semiconductor Device Reliability Physics, Beijing; 100124, China
  • [ 3 ] [Feng, Shiwei]Beijing University of Technology, Institute of Semiconductor Device Reliability Physics, Beijing; 100124, China
  • [ 4 ] [Yang, Yang]Institute of Nanjing Electronic Devices, Nanjing; 210016, China
  • [ 5 ] [Xu, Chao]Beijing University of Technology, Institute of Semiconductor Device Reliability Physics, Beijing; 100124, China
  • [ 6 ] [Huo, Shuai]Institute of Nanjing Electronic Devices, Nanjing; 210016, China
  • [ 7 ] [Lu, Xiaozhuang]Beijing University of Technology, Institute of Semiconductor Device Reliability Physics, Beijing; 100124, China
  • [ 8 ] [Zhang, Yamin]Beijing University of Technology, Institute of Semiconductor Device Reliability Physics, Beijing; 100124, China
  • [ 9 ] [Bai, Kun]Beijing University of Technology, Institute of Semiconductor Device Reliability Physics, Beijing; 100124, China
  • [ 10 ] [Bai, Kun]Space Engineering University, Key Laboratory of Intelligent Space TTC&O, Ministry of Education, Beijing; 101416, China

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Source :

IEEE Transactions on Instrumentation and Measurement

ISSN: 0018-9456

Year: 2025

Volume: 74

5 . 6 0 0

JCR@2022

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 2

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