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Abstract:
A novel multi-finger power SiGe heterojunction bipolar transistor (HBT) with segmented emitter and non-uniform finger spacing structure is proposed to improve thermal stability of HBT. Thermal simulation for a ten-finger power SiGe HBT with novel structure are conducted with ANSYS software. Three-dimensional temperature distribution on emitter fingers is obtained. Compared with traditional integrity structure or segmented emitter and uniform finger spacing structure, the maximum junction temperature, temperature distribution and heat-flux distribution are significantly improved. Thermal stability is effectively enhanced.
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Source :
Journal of Beijing University of Technology
ISSN: 0254-0037
Year: 2011
Issue: 5
Volume: 37
Page: 697-700
Cited Count:
WoS CC Cited Count: 0
SCOPUS Cited Count:
ESI Highly Cited Papers on the List: 0 Unfold All
WanFang Cited Count:
Chinese Cited Count:
30 Days PV: 9
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