Microstructure and performance of SnAgCuEr lead-free solders with rare earth - Details

Author：

Tian, Jun (Tian, Jun.) | Hao, Hu (Hao, Hu.) | Shi, Yao-Wu (Shi, Yao-Wu.) | Lei, Yong-Ping (Lei, Yong-Ping.) (Scholars：雷永平) | Xia, Zhi-Dong (Xia, Zhi-Dong.)

Indexed by：

EI Scopus PKU CSCD

Abstract：

The　effect　of　minimal　amount　of　rare　earth　Er　on　the　microstructure　and　performance　of　Sn3.8Ag0.7Cu　solder　alloy　has　been　systematically　investigated.　Through　measuring　the　melting　temperature,　wettability　and　joint　shear　strength,　and　observing　the　microstructure,　it　is　indicated　that　the　SnAgCuEr　alloy　containing　rare　earth　is　a　lead-free　solder　with　an　excellent　performance.　At　the　same　time　the　best　content　of　Er　is　determined.

Keyword：

Silver alloys Copper alloys Metallographic microstructure Soldering alloys Melting point Tin alloys Wetting Erbium alloys Shear strength

Author Community：

[ 1 ] [Tian, Jun]School of Materials Science and Engineering, Beijing University of Technology, Beijing 100022, China
[ 2 ] [Hao, Hu]School of Materials Science and Engineering, Beijing University of Technology, Beijing 100022, China
[ 3 ] [Shi, Yao-Wu]School of Materials Science and Engineering, Beijing University of Technology, Beijing 100022, China
[ 4 ] [Lei, Yong-Ping]School of Materials Science and Engineering, Beijing University of Technology, Beijing 100022, China
[ 5 ] [Xia, Zhi-Dong]School of Materials Science and Engineering, Beijing University of Technology, Beijing 100022, China

Reprint Author's Address：

Email：

tianjun@emails.bjut.edu.cn

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Related Keywords：

Effect of Ag content on properties of SnAgCuX lead-free solder
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Analysis for microstructure and mechanical property of Sn-3Ag-0.5Cu solder joints in high density LED packages
2012，Transactions of the China Welding Institution
Effect of loading rate on shear strength of SnAgCu solder joint
2010，Transactions of the China Welding Institution

Source ：

Material Science and Technology

ISSN： 1005-0299

Year： 2008

Issue： 2

Volume： 16

Page： 281-283

Cited Count：

WoS CC Cited Count： 0

SCOPUS Cited Count：

ESI Highly Cited Papers on the List： 0 Unfold All

WanFang Cited Count：

Chinese Cited Count：

30 Days PV： 2

Affiliated Colleges：

材料科学与工程学院本学院/部未明确归属的数据

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