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Author:

Liu, Xin (Liu, Xin.) | Xia, Zhi-Dong (Xia, Zhi-Dong.) | Lei, Yong-Ping (Lei, Yong-Ping.) (Scholars:雷永平) | Shi, Yao-Wu (Shi, Yao-Wu.)

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Abstract:

The mixed Sn and Cu powder was milled by mechanical ball milling. The milled powders were analyzed by X-ray diffraction, differential thermal analyzer and scanning electron microscopy. The effect of ball milling conditions on the formation of Sn-0.7Cu alloy was investigated. The results showed that voltage, ball-to-powder mass ratio and milling time affect the formation of Sn-0.7Cu alloy significantly. The mechanism of mechanical alloying Sn-Cu was that the mechanically-induced atom diffusion drives substitutional solid solution and interface dissolution, as a result of which Cu6Sn5 was formed.

Keyword:

Ball milling Dissolution Diffusion Solid solutions Mechanical alloying Tin alloys Mixing Interfaces (materials) Powders Copper

Author Community:

  • [ 1 ] [Liu, Xin]Laboratory of Advanced Functional Material, Beijing University of Technology, Beijing 100022, China
  • [ 2 ] [Xia, Zhi-Dong]Laboratory of Advanced Functional Material, Beijing University of Technology, Beijing 100022, China
  • [ 3 ] [Lei, Yong-Ping]Laboratory of Advanced Functional Material, Beijing University of Technology, Beijing 100022, China
  • [ 4 ] [Shi, Yao-Wu]Laboratory of Advanced Functional Material, Beijing University of Technology, Beijing 100022, China

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Source :

Transactions of the China Welding Institution

ISSN: 0253-360X

Year: 2005

Issue: 5

Volume: 26

Page: 9-12

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 2

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