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Author:

Ling, Haoshu (Ling, Haoshu.) | Wang, Liang (Wang, Liang.) | Chen, Chao (Chen, Chao.) (Scholars:陈超) | Wang, Yifei (Wang, Yifei.) | Chen, Haisheng (Chen, Haisheng.)

Indexed by:

EI Scopus SCIE

Abstract:

Incorporating phase change material (PCM) into building envelops is an effective way for reducing building energy consumption. Compared to field measurements, numerical modelling offers an inexpensive alternative to analyze and optimize the thermal performance of PCM envelops. However, it is always assumed that there is no difference for the thermophysical properties correlation of PCM between the charging and discharging processes in the current numerical studies. The assumption isn't consistent with the real thermophysical properties correlation of PCM, which will increase the uncertainty of numerical analysis. To validate this phenomenon, a PCM was introduced and its thermophysical properties correlation was measured in both charging and discharging processes. Then the PCM was pasted on the inner surface of a ventilated wall in a solar greenhouse, and its numerical model was established. Finally, the thermophysical properties correlation of PCM was input to the developed model with nine assumptions. The results showed that there was a difference for thermophysical properties correlation of PCM between the charging and discharging processes. The calculated data would have the best agreement with the experiment, if the thermophysical properties correlation of PCM in both charging and discharging processes was input using the numerical approximation. The thermophysical properties correlation of PCM had a significant influence on the thermal performance of PCM, hollow blocks and solid blocks, while it had little contribution on the insulation layer.

Keyword:

Phase change material Thermophysical properties correlation Numerical modelling Thermal property Accuracy

Author Community:

  • [ 1 ] [Ling, Haoshu]Chinese Acad Sci, Inst Engn Thermophys, Beijing 100190, Peoples R China
  • [ 2 ] [Wang, Liang]Chinese Acad Sci, Inst Engn Thermophys, Beijing 100190, Peoples R China
  • [ 3 ] [Wang, Yifei]Chinese Acad Sci, Inst Engn Thermophys, Beijing 100190, Peoples R China
  • [ 4 ] [Chen, Haisheng]Chinese Acad Sci, Inst Engn Thermophys, Beijing 100190, Peoples R China
  • [ 5 ] [Wang, Liang]Univ Chinese Acad Sci, Beijing 100049, Peoples R China
  • [ 6 ] [Chen, Haisheng]Univ Chinese Acad Sci, Beijing 100049, Peoples R China
  • [ 7 ] [Chen, Chao]Beijing Univ Technol, Coll Architecture & Civil Engn, Beijing 100124, Peoples R China

Reprint Author's Address:

  • 陈超

    [Chen, Haisheng]Chinese Acad Sci, Inst Engn Thermophys, Beijing 100190, Peoples R China;;[Chen, Chao]Beijing Univ Technol, Coll Architecture & Civil Engn, Beijing 100124, Peoples R China

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Source :

APPLIED THERMAL ENGINEERING

ISSN: 1359-4311

Year: 2019

Volume: 157

6 . 4 0 0

JCR@2022

ESI Discipline: ENGINEERING;

ESI HC Threshold:136

JCR Journal Grade:1

Cited Count:

WoS CC Cited Count: 21

SCOPUS Cited Count: 23

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 6

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