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Author:

Li, Fang (Li, Fang.) | Chen, Shujun (Chen, Shujun.) (Scholars:陈树君) | Wu, Zhaoyang (Wu, Zhaoyang.)

Indexed by:

EI Scopus

Abstract:

Wire and arc additive manufacturing (WAAM) has attracted more and more research interest nowadays. In WAAM, the travel speed should keep as high as possible for a high deposition rate, and as constant as possible for a uniform deposition morphology along the tool-path. Nevertheless, the two goals are always violated in practice because the welding robot, controlled by CNC (Computer Numerical Control), has to slow down when sharp corners with high curvatures are encountered so as to respect the dynamic constraint. To cope with this problem, a new CNC framework is proposed with the objective of guaranteeing a uniform deposition morphology along the tool-path while still respecting the dynamic constraint. The idea is to split the tool-path into several segments depending on whether they contain sharp corners and then determine the allowable travel speed of each segment separately subjected to the dynamic constraint. In addition, the wire-feed rate is adaptively controlled to match the corresponding travel speed for a uniform deposition morphology. Experimental results demonstrate that the new CNC framework greatly improves the uniformity of the deposition morphology compared to the conventional one. © 2017 IEEE.

Keyword:

Morphology Wire Computer control systems Robot applications 3D printers Additives Industrial research Intelligent systems Deposition rates

Author Community:

  • [ 1 ] [Li, Fang]Beijing Welding Equipment Research and Development Center, Beijing University of Technology, Beijing; 100124, China
  • [ 2 ] [Chen, Shujun]Beijing Welding Equipment Research and Development Center, Beijing University of Technology, Beijing; 100124, China
  • [ 3 ] [Wu, Zhaoyang]Beijing Welding Equipment Research and Development Center, Beijing University of Technology, Beijing; 100124, China

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Source :

Year: 2017

Page: 781-784

Language: English

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count: 1

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 8

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