Thermal　cycling　reliability　test　and　finite　element　analysis　have　been　conducted　for　plastic　ball　grid　array　assembly　with　Sn63Pb37　solder.　Based　on　the　thermal　cycling　test　results,　a　two-parameter　Weibull　distribution　model　was　used　to　determine　the　characteristic　time　to　failure　of　plastic　ball　grid　array　assembly.　Besides,　cross-sectioning　and　optical　microscope　examination　were　utilized　to　identify　the　failure　mechanism　and　locations　of　solder　joints.　Finite　element　analysis　with　quarter　model　was　implemented　to　obtain　the　strain　and　stress　of　solder　joints.　Furthermore,　viscoplastic　Anand＇s　model　was　used　to　describe　the　constitutive　equation　of　Sn63Pb37　solder.　The　life　prediction　model　was　established　based　on　Engelmaier＇s　model　at　last.　©　2016　IEEE.