W-Ni-Cu　compound　materials　were　obtained　by　a　fused-salt　electrolysis　method　and　an　aqueous　solution　electrolysis　method.　W-Ni-Cu　functionally　graded　materials　(FGM)　characterized　with　different　thickness　(25,　35　and　45　gm)　were　obtained　from　the　compound　materials　after　annealing　at　800　degrees　C　for　60,　120　and　180　min,　respectively,　and　Ni　plays　a　role　in　bridging　Cu　and　W.　Cracks　and　abscission　are　not　present　in　the　surface　of　samples　after　thermal　shock　and　thermal　fatigue,　which　indicates　the　material　has　good　bonding　properties.　Thermal　conductivity　tests　were　also　conducted,　and　the　result　shows　that　the　thermal　conductivity　of　pure　W　plate　and　W-Ni-Cu　FGM　decrease　with　increasing　temperature　(25　similar　to　800　degrees　C).　The　thermal　conductivity　of　pure　W　plate　is　higher　than　that　of　W-Ni-Cu　FGM　at　the　same　temperature.　The　thermal　conductivity　of　W-Ni-Cu　FGM　decreases　with　increasing　gradient　thickness.