The　thermal-mechanical　reliability　of　the　flip-chip　with　copper　pillar　bump　is　analyzed　through　finite　element　numerical　simulation　and　Kriging　response　surface　models　optimization　method.　The　results　show　that:　the　successive　order　of　factors　affecting　the　chip　warpage　is:　die　thickness,　bump　pitch,　die　thickness,　substrate　thickness,　Cu　Pillar　height,　Cu　Pillar　height,　PI　thickness,　PI　opening　size;　the　successive　order　of　factors　affecting　the　stress　is:　PI　opening　size,　bump　pitch,　PI　thickness,　die　thickness,　Cu　Pillar　height,　substrate　thickness;　the　objectives　and　constraints　are　explicated　through　Kriging　model.　In　Kriging　model,　the　quadratic　form　is　adopted　as　regression　function,　Gaussian　function　is　chosen　as　correlative　function,　and　sequential　quadratic　programming　is　used　to　solve　the　problem.　After　optimization,　the　first　principal　stress　is　decreased　significantly　on　the　Low-K　layer;　meanwhile,　chip　warpage　is　under　control.　©　2015　IEEE.