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Author:

孟超 (孟超.) | 王群 (王群.) (Scholars:王群) | 施楣梧 (施楣梧.)

Indexed by:

CQVIP

Abstract:

利用电化学沉积法制备了铁镍合金薄膜,研究了离子浓度比、pH、温度、电流密度等工艺条件对镀层成分含量的影响,并对镀层的表面形貌、内应力、物相组成、磁性能及屏蔽效能等进行了表征,优化出了最优工艺参数,得到了性能优异、可剥离的铁镍合金薄膜.

Keyword:

铁镍合金 软磁薄膜 电化学沉积

Author Community:

  • [ 1 ] [孟超]北京工业大学
  • [ 2 ] [王群]北京工业大学
  • [ 3 ] [施楣梧]总后勤部军需装备研究所

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Source :

安全与电磁兼容

ISSN: 1005-9776

Year: 2015

Issue: 4

Page: 58-61

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count: 2

Chinese Cited Count:

30 Days PV: 7

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