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Author:

Liu, X. -D. (Liu, X. -D..) | Shang, D. -G. (Shang, D. -G..) (Scholars:尚德广) | Zhang, Li. -H. (Zhang, Li. -H..) | Sun, Y. -J. (Sun, Y. -J..) | Chen, T. (Chen, T..)

Indexed by:

EI Scopus SCIE

Abstract:

A healing method for fatigue damage was studied by laser shock peening (LSP) with excimer laser for polycrystalline copper film. It is found that work hardening due to LSP could be responsible for the improvement of residual fatigue lives for the damaged and undamaged specimens by LSP, and the hardening degree for the damaged specimen by LSP is obviously higher than that for the undamaged specimen by LSP. In this paper, two basic mechanisms were identified. One is the dissipated energy enhancement mechanism, which improves the fatigue life caused by laser shock stress, and the other is the healing mechanism, which leads to a further improvement. Based on the two mechanisms, a residual fatigue life prediction method is proposed by the view of energy consumption before and after LSP. The predicted lives by the proposed method agree well with the experimental results.

Keyword:

life prediction work hardening laser shock peening dissipated energy enhancement mechanism healing mechanism

Author Community:

  • [ 1 ] [Liu, X. -D.]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing 100124, Peoples R China
  • [ 2 ] [Shang, D. -G.]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing 100124, Peoples R China
  • [ 3 ] [Zhang, Li. -H.]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing 100124, Peoples R China
  • [ 4 ] [Sun, Y. -J.]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing 100124, Peoples R China
  • [ 5 ] [Chen, T.]Beijing Univ Technol, Inst Laser Engn, Beijing 100124, Peoples R China

Reprint Author's Address:

  • 尚德广

    [Shang, D. -G.]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing 100124, Peoples R China

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Source :

FATIGUE & FRACTURE OF ENGINEERING MATERIALS & STRUCTURES

ISSN: 8756-758X

Year: 2014

Issue: 4

Volume: 37

Page: 427-435

3 . 7 0 0

JCR@2022

ESI Discipline: MATERIALS SCIENCE;

ESI HC Threshold:341

JCR Journal Grade:2

CAS Journal Grade:3

Cited Count:

WoS CC Cited Count: 9

SCOPUS Cited Count: 9

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 11

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