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Author:

Liu, Xiao-Dong (Liu, Xiao-Dong.) | Shang, De-Guang (Shang, De-Guang.) (Scholars:尚德广) | Li, Ming (Li, Ming.) | Jin, Jia (Jin, Jia.) | Chen, Tao (Chen, Tao.) | Guo, Y. B. (Guo, Y. B..) | Barkey, M. E. (Barkey, M. E..)

Indexed by:

EI Scopus SCIE

Abstract:

A repair method for fatigue damage was studied by laser shock peening (LSP) with excimer laser for polycrystalline copper film. Two basic effects were defined. One is the enhanced effect, which improves the fatigue life for the non-damaged specimen by LSP, and the other is the healing effect, which has a further improvement for the damaged specimens. The results showed that, in most cases, LSP has a pure healing effect in addition to an enhanced effect for the damaged specimens. The energy analysis revealed the work hardening due to LSP is the main reason for the improvement of residual fatigue lives for the damaged specimens. (C) 2013 Elsevier Ltd. All rights reserved.

Keyword:

Healing effect Enhanced effect Fatigue life Laser shock peening

Author Community:

  • [ 1 ] [Liu, Xiao-Dong]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing 100124, Peoples R China
  • [ 2 ] [Shang, De-Guang]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing 100124, Peoples R China
  • [ 3 ] [Li, Ming]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing 100124, Peoples R China
  • [ 4 ] [Jin, Jia]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing 100124, Peoples R China
  • [ 5 ] [Chen, Tao]Beijing Univ Technol, Inst Laser Engn, Beijing 100124, Peoples R China
  • [ 6 ] [Guo, Y. B.]Univ Alabama, Dept Mech Engn, Tuscaloosa, AL 35487 USA
  • [ 7 ] [Barkey, M. E.]Univ Alabama, Dept Aerosp Engn & Mech, Tuscaloosa, AL 35487 USA

Reprint Author's Address:

  • 尚德广

    [Shang, De-Guang]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing 100124, Peoples R China

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Source :

INTERNATIONAL JOURNAL OF FATIGUE

ISSN: 0142-1123

Year: 2013

Volume: 54

Page: 127-132

6 . 0 0 0

JCR@2022

ESI Discipline: MATERIALS SCIENCE;

JCR Journal Grade:1

CAS Journal Grade:3

Cited Count:

WoS CC Cited Count: 23

SCOPUS Cited Count: 23

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 7

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