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Author:

刘朝 (刘朝.) | 万培元 (万培元.) | 于忠臣 (于忠臣.)

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CQVIP

Abstract:

验证是SoC(系统芯片)设计的重要环节,FPGA原型验证平台能以实时的方式进行软硬件协同验证,缩短SoC的开发周期,验证系统级芯片软硬件设计的正确性,降低SoC系统的开发成本。本文介绍了基于ARM7TDMI处理器核的SoC芯片设计项目,提出相应的FPGA软硬件协同设计与验证的方案,并在此SoC芯片开发过程中得以实施,取得良好效果。

Keyword:

SoC FPGA 软硬件协同验证

Author Community:

  • [ 1 ] [刘朝]北京工业大学
  • [ 2 ] [万培元]北京工业大学
  • [ 3 ] [于忠臣]北京工业大学

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Source :

数字技术与应用

ISSN: 1007-9416

Year: 2013

Issue: 12

Page: 73-73,75

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count: 1

Chinese Cited Count:

30 Days PV: 11

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