The　physical　properties,　solderability,　and　creep-rupture　life　of　the　nanosized　Ag　particle-reinforced　Sn-Pb　composite　solder　were　investigated.　The　experimental　results　indicate　that　the　composite　solder　possesses　good　electrical　conductivity　as　well　as　good　solderability.　Compared　to　the　eutectic　63Sn-37Pb　solder　matrix,　the　nanosized　Ag　particle-reinforced　composite　solder　improved　the　creep　resistance　and　significantly　enhanced　the　creep-rupture　life　of　its　solder　joints.　The　fracture　surface　revealed　a　mixture　of　ductile　and　brittle　fracture　features.