The　increasing　use　of　light-emitting　diodes　(LEDs)　requires　advances　in　heat　dissipation.　Previous　applications　of　heat　pipes　for　LED　cooling　faced　the　challenges　of　contact　thermal　resistance　and　insufficient　heat　transfer　areas.　In　this　study,　a　novel　heat　sink　based　on　a　mini-heat　pipe　array　(MHPA)　is　proposed,　which　can　overcome　these　challenges.　The　thermal　performance　of　the　heat　sink　was　experimentally　tested.　The　substrate　temperature　can　be　reduced　below　70　degrees　C　when　the　input　power　is　100　W.　MHPA　shows　good　temperature　uniformity.　When　the　input　power　is　100　W　and　200　W,　the　maximum　temperature　drops　of　MHPA　in　the　vertical　direction　are　0.6　degrees　C　and　1.1　degrees　C,　respectively.　A　numerical　model　was　established　and　validated.　The　effect　of　the　heat　sink　structure　was　investigated　using　numerical　methods.　A　higher　fin　height　and　more　cross-cuts　can　enhance　heat　transfer.　When　the　fin　pitch　is　less　than　10　mm,　increasing　the　pitch　is　beneficial　to　heat　transfer.　Appropriate　use　of　variable　fins　can　enhance　heat　transfer.　Orthogonal　tests　are　designed　to　find　the　optimal　heat　sink　structure.　The　optimal　structure　has　a　fin　pitch　of　8　mm,　a　fin　height　of　43　mm,　a　fin　thickness　of　0.5　mm,　40%　of　the　variable　fins,　and　6　cross-cuts.