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Author:

Cui, Tiantian (Cui, Tiantian.) | Ma, Guoyuan (Ma, Guoyuan.) | Wang, Lei (Wang, Lei.)

Indexed by:

EI Scopus SCIE

Abstract:

Both pump-driven heat pipe loops and heat pump loops can operate in heat transfer environments where the temperature of the heat source is higher than that of the heat sink. To investigate the fundamental utilization of input work during heat transfer processes in two distinct loops, this study employed the theory of entransy to conduct an in-depth analysis of the heat transfer processes in pump-driven heat pipe loops and heat pump loops. The research initially explored these loops' limiting conditions for cyclic heat transfer. Subsequently, the concept of antransy was introduced to elucidate the substantial role of input work in the heat transfer processes. By the antransy, this paper further analyzed the practical utilization degree of input work, providing theoretical insights for optimizing heat transfer systems. The results indicate that the form of loops and the heat transfer conditions influence the magnitude of input work. Precisely, the input work in the loops compensates for the entransy loss that occurs when the working fluid exchanges heat with the environment. More input work does not necessarily translate into more substantial heat transfer. Furthermore, the utilization degree of input work in different loops depends on factors such as the heat transfer environment, the amount of heat transferred, and the heat capacity of the working fluid. The concept of antransy effectively assesses the efficient utilization of input work in these loops. By analyzing the antransy generated in the system, we can better understand how efficiently the input work is utilized in the heat transfer process. The research findings have enriched the field of entransy theory, providing new insights and perspectives into this area of study. Moreover, the results can promote and offer fresh ideas for optimizing cyclic heat transfer systems.

Keyword:

Heat pipe Input work Heat pump Entransy Antransy

Author Community:

  • [ 1 ] [Cui, Tiantian]Beijing Univ Technol, Dept Refrigerat & Cryogen Engn, Beijing 100124, Peoples R China
  • [ 2 ] [Ma, Guoyuan]Beijing Univ Technol, Dept Refrigerat & Cryogen Engn, Beijing 100124, Peoples R China
  • [ 3 ] [Wang, Lei]Beijing Univ Technol, Dept Refrigerat & Cryogen Engn, Beijing 100124, Peoples R China

Reprint Author's Address:

  • [Wang, Lei]Beijing Univ Technol, Dept Refrigerat & Cryogen Engn, Beijing 100124, Peoples R China;;

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Source :

THERMAL SCIENCE AND ENGINEERING PROGRESS

ISSN: 2451-9049

Year: 2024

Volume: 56

4 . 8 0 0

JCR@2022

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 7

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