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Author:

Dai, Yanwei (Dai, Yanwei.) | Zan, Zhi (Zan, Zhi.) | Zhao, Shuai (Zhao, Shuai.) | Qin, Fei (Qin, Fei.)

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EI Scopus SCIE

Abstract:

Various contents of nickel coated carbon nanotube added sintered silver joints are fabricated through mechanical alloying. An analytical method is presented to compute the fracture energy of ENF tests incorporating shearing effect and thickness effect, which shows better accuracy compared with traditional method, which are closer to the solutions of compliance based beam method. Mode II fracture energy, mode II fracture toughness and mode II cohesive zone model for different contents of nickel coated carbon nanotube added sintered silver joints are presented based on the data extraction of the ENF tests. With the increase of adhesive layer thickness, the fracture energy and the mode II fracture toughness improve. However, thickness effect is less significant but not negligible comparing with the strengthening effect on the improvement of fracture toughness, which is caused by adding nickel coated multiwall carbon nanotubes. The relation between mode II fracture toughness and porosity is also discussed. For most of the conditions, the mode II fracture toughness is higher than mode I fracture toughness regardless of additive content due to the crack deflection, crack bridging and pull-out mechanisms during the crack propagation except for those high content of additive whose fracture energy is reduced because of aggregation effect. © 2022 Elsevier Ltd

Keyword:

Silver Sintering Adhesives Fracture Nickel coatings Cracks Mechanical alloying Porosity Multiwalled carbon nanotubes (MWCN) Additives Fracture toughness

Author Community:

  • [ 1 ] [Dai, Yanwei]Institute of Electronics Packaging Technology and Reliability, Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing; 100124, China
  • [ 2 ] [Dai, Yanwei]Beijing Key Laboratory of Advanced Manufacturing Technology, Beijing University of Technology, Beijing; 100124, China
  • [ 3 ] [Zan, Zhi]Institute of Electronics Packaging Technology and Reliability, Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing; 100124, China
  • [ 4 ] [Zhao, Shuai]Institute of Electronics Packaging Technology and Reliability, Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing; 100124, China
  • [ 5 ] [Qin, Fei]Institute of Electronics Packaging Technology and Reliability, Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing; 100124, China
  • [ 6 ] [Qin, Fei]Beijing Key Laboratory of Advanced Manufacturing Technology, Beijing University of Technology, Beijing; 100124, China

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Source :

Theoretical and Applied Fracture Mechanics

ISSN: 0167-8442

Year: 2022

Volume: 121

5 . 3

JCR@2022

5 . 3 0 0

JCR@2022

ESI Discipline: ENGINEERING;

ESI HC Threshold:49

JCR Journal Grade:1

CAS Journal Grade:2

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count: 10

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 3

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