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Author:

Huang, Yuling (Huang, Yuling.) | Zhang, Bin (Zhang, Bin.) | Li, Jingwei (Li, Jingwei.) | Zhou, Zizhen (Zhou, Zizhen.) | Zheng, Sikang (Zheng, Sikang.) | Li, Nanhai (Li, Nanhai.) | Wang, Guiwen (Wang, Guiwen.) | Zhang, De (Zhang, De.) | Zhang, Daliang (Zhang, Daliang.) | Han, Guang (Han, Guang.) | Wang, Guoyu (Wang, Guoyu.) | Han, Xiaodong (Han, Xiaodong.) | Lu, Xu (Lu, Xu.) | Zhou, Xiaoyuan (Zhou, Xiaoyuan.)

Indexed by:

EI Scopus SCIE

Abstract:

Thermoelectric materials are typically highly degenerate semiconductors, which require high carrier concentration. However, the efficiency of conventional doping by replacing host atoms with alien ones is restricted by solubility limit, and, more unfavorably, such a doping method is likely to cause strong charge-carrier scattering at ambient temperature, leading to deteriorated electrical performance. Here, an unconventional doping strategy is proposed, where a small trace of alien atoms is used to stabilize cation vacancies in Cu3SbSe4 by compositing with CuAlSe2, in which the cation vacancies rather than the alien atoms provide a high density of holes. Consequently, the hole concentration enlarges by six times but the carrier mobility is well maintained. As a result, a record-high average power factor of 19 µW cm−1 K−2 in the temperature range of 300–723 K is attained. Finally, with further reduced lattice thermal conductivity, a peak zT value of 1.4 and a record-high average zT value of 0.72 are achieved within the diamond-like compounds. This new doping strategy not only can be applied for boosting the average power factor for thermoelectrics, but more generally can be used to maintain carrier mobility for a variety of semiconductors that need high carrier concentration. © 2022 Wiley-VCH GmbH.

Keyword:

Hole concentration Atoms Thermoelectric power Copper compounds Antimony compounds Electric power factor Positive ions Selenium compounds Electric conductivity Aluminum compounds Semiconductor doping Thermal conductivity Hole mobility

Author Community:

  • [ 1 ] [Huang, Yuling]College of Physics, Chongqing University, Chongqing; 401331, China
  • [ 2 ] [Zhang, Bin]Analytical and Testing Center, Chongqing University, Chongqing; 401331, China
  • [ 3 ] [Li, Jingwei]Multi-scale Porous Materials Center, Institute of Advanced Interdisciplinary Studies & School of Chemistry and Chemical Engineering, Chongqing University, Chongqing; 401331, China
  • [ 4 ] [Zhou, Zizhen]College of Physics, Chongqing University, Chongqing; 401331, China
  • [ 5 ] [Zhou, Zizhen]Center for Quantum Materials & Devices, Chongqing University, Chongqing; 401331, China
  • [ 6 ] [Zheng, Sikang]College of Physics, Chongqing University, Chongqing; 401331, China
  • [ 7 ] [Li, Nanhai]College of Physics, Chongqing University, Chongqing; 401331, China
  • [ 8 ] [Wang, Guiwen]Analytical and Testing Center, Chongqing University, Chongqing; 401331, China
  • [ 9 ] [Zhang, De]College of Physics, Chongqing University, Chongqing; 401331, China
  • [ 10 ] [Zhang, Daliang]Multi-scale Porous Materials Center, Institute of Advanced Interdisciplinary Studies & School of Chemistry and Chemical Engineering, Chongqing University, Chongqing; 401331, China
  • [ 11 ] [Han, Guang]College of Materials Science and Engineering, Chongqing University, Chongqing; 400044, China
  • [ 12 ] [Wang, Guoyu]Chongqing Institute of Green and Intelligent Technology, Chinese Academy of Sciences, Chongqing; 400714, China
  • [ 13 ] [Han, Xiaodong]Beijing Key Laboratory of Microstructure and Property of Advanced Materials, Beijing University of Technology, Beijing; 100024, China
  • [ 14 ] [Lu, Xu]College of Physics, Chongqing University, Chongqing; 401331, China
  • [ 15 ] [Lu, Xu]Center for Quantum Materials & Devices, Chongqing University, Chongqing; 401331, China
  • [ 16 ] [Zhou, Xiaoyuan]College of Physics, Chongqing University, Chongqing; 401331, China
  • [ 17 ] [Zhou, Xiaoyuan]Analytical and Testing Center, Chongqing University, Chongqing; 401331, China
  • [ 18 ] [Zhou, Xiaoyuan]Center for Quantum Materials & Devices, Chongqing University, Chongqing; 401331, China

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Source :

Advanced Materials

ISSN: 0935-9648

Year: 2022

Issue: 14

Volume: 34

2 9 . 4

JCR@2022

2 9 . 4 0 0

JCR@2022

ESI Discipline: MATERIALS SCIENCE;

ESI HC Threshold:66

JCR Journal Grade:1

CAS Journal Grade:1

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count: 58

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 4

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