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Author:

Xie, Na (Xie, Na.) | Zhu, Hui (Zhu, Hui.) | Zhang, Yiqun (Zhang, Yiqun.) | Huang, Zeng (Huang, Zeng.) | Fang, Zhixuan (Fang, Zhixuan.) | Liu, Zheng (Liu, Zheng.) | Li, Dong (Li, Dong.) | Feng, Shiwei (Feng, Shiwei.) | Guo, Chunsheng (Guo, Chunsheng.) | Zhang, Yamin (Zhang, Yamin.) | Liu, Bo (Liu, Bo.) | Zhou, Lixing (Zhou, Lixing.) | Liu, Xing (Liu, Xing.) | Sun, Yerong (Sun, Yerong.) | Zhang, Zhirang (Zhang, Zhirang.) | Li, Yilin (Li, Yilin.) | Yao, Zhiwen (Yao, Zhiwen.)

Indexed by:

EI Scopus SCIE

Abstract:

Changes in the electrical properties and trap characteristics of flexible low-temperature polysilicon thin-film transistors (TFTs) under the application of uniaxial bending strains and during repetitive bending cycles were investigated. When the bending strain increased, the transfer curve showed a negative shift, the output current decreased, and the subthreshold slope increased. After the bending strains were removed, the electrical performance showed recovery behavior, but the device performance could not return fully to its original state. The devices were also subjected to repetitive bending cycles. The transfer curves showed a positive shift after 10(4) bending cycles and the output current increased. Using the transient current method, it was established that the detrapping time constant of the traps decreased and the peak amplitudes increased as a result of both the bending strain and the bending cycles. However, while the trap activation energy was not changed by static bending, it did decrease after the repetitive bending cycles. Both the changes in the electrical properties and the time constant spectra confirm that the trap state density increased as a result of the bending processes. However, the different trapping behaviors contributed to different degradations in the device's electrical properties.

Keyword:

transient current flexible low-temperature polycrystalline silicon (LTPS) thin-film transistor (TFT) trap state density Device degradation uniaxial bending

Author Community:

  • [ 1 ] [Xie, Na]Beijing Univ Technol, Fac Informat Technol, Sch Microelect, Beijing 100124, Peoples R China
  • [ 2 ] [Zhu, Hui]Beijing Univ Technol, Fac Informat Technol, Sch Microelect, Beijing 100124, Peoples R China
  • [ 3 ] [Zhang, Yiqun]Beijing Univ Technol, Fac Informat Technol, Sch Microelect, Beijing 100124, Peoples R China
  • [ 4 ] [Huang, Zeng]Beijing Univ Technol, Fac Informat Technol, Sch Microelect, Beijing 100124, Peoples R China
  • [ 5 ] [Fang, Zhixuan]Beijing Univ Technol, Fac Informat Technol, Sch Microelect, Beijing 100124, Peoples R China
  • [ 6 ] [Feng, Shiwei]Beijing Univ Technol, Fac Informat Technol, Sch Microelect, Beijing 100124, Peoples R China
  • [ 7 ] [Guo, Chunsheng]Beijing Univ Technol, Fac Informat Technol, Sch Microelect, Beijing 100124, Peoples R China
  • [ 8 ] [Zhang, Yamin]Beijing Univ Technol, Fac Informat Technol, Sch Microelect, Beijing 100124, Peoples R China
  • [ 9 ] [Liu, Bo]Beijing Univ Technol, Fac Informat Technol, Sch Microelect, Beijing 100124, Peoples R China
  • [ 10 ] [Zhou, Lixing]Beijing Univ Technol, Fac Informat Technol, Sch Microelect, Beijing 100124, Peoples R China
  • [ 11 ] [Liu, Xing]Beijing Univ Technol, Fac Informat Technol, Sch Microelect, Beijing 100124, Peoples R China
  • [ 12 ] [Sun, Yerong]Beijing Univ Technol, Fac Informat Technol, Sch Microelect, Beijing 100124, Peoples R China
  • [ 13 ] [Zhang, Zhirang]Beijing Univ Technol, Fac Informat Technol, Sch Microelect, Beijing 100124, Peoples R China
  • [ 14 ] [Li, Yilin]Beijing Univ Technol, Fac Informat Technol, Sch Microelect, Beijing 100124, Peoples R China
  • [ 15 ] [Yao, Zhiwen]Beijing Univ Technol, Fac Informat Technol, Sch Microelect, Beijing 100124, Peoples R China
  • [ 16 ] [Liu, Zheng]BOE Technol Grp Co Ltd, Beijing 100016, Peoples R China
  • [ 17 ] [Li, Dong]BOE Technol Grp Co Ltd, Beijing 100016, Peoples R China

Reprint Author's Address:

  • [Zhu, Hui]Beijing Univ Technol, Fac Informat Technol, Sch Microelect, Beijing 100124, Peoples R China;;

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Source :

IEEE TRANSACTIONS ON ELECTRON DEVICES

ISSN: 0018-9383

Year: 2022

Issue: 2

Volume: 70

Page: 544-549

3 . 1

JCR@2022

3 . 1 0 0

JCR@2022

ESI Discipline: ENGINEERING;

ESI HC Threshold:49

JCR Journal Grade:2

CAS Journal Grade:2

Cited Count:

WoS CC Cited Count: 2

SCOPUS Cited Count: 2

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 5

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