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Author:

Shi, Tai-feng (Shi, Tai-feng.) | Zheng, Jing-yuan (Zheng, Jing-yuan.) | Wang, Xia (Wang, Xia.) | Zhang, Peng (Zhang, Peng.) | Zong, Peng-an (Zong, Peng-an.) | Razeeb, Kafil M. (Razeeb, Kafil M..)

Indexed by:

EI Scopus SCIE

Abstract:

Thermoelectric (TE) technology enables direct conversion between thermal and electrical energies and thus has been regarded as an alternative for energy harvesting and refrigeration. Bismuth telluride (Bi2Te3) is the most widely used TE material at room temperature due to its high figure of merit (similar to 1). Since the first publication on the electrodeposition of Bi2Te3 films in 1994, a large number of publications has emerged in the last two decades, owing to its advantages such as simple and safe preparation, high deposition rate, convenient micromachining, good compatibility to semiconductor microfabrication techniques and so on. This article reviews the recent research progress in the electrodeposition of Bi2Te3 and its application in TE devices. Additionally, an outlook towards the future development of this area has also been discussed.

Keyword:

microstructures electrodeposition Bi2Te3-based ternary alloys bismuth telluride cooler Thermoelectric nanocomposite generator

Author Community:

  • [ 1 ] [Shi, Tai-feng]Nanjing Tech Univ, Coll Mat Sci & Engn, Nanjing 210009, Peoples R China
  • [ 2 ] [Zheng, Jing-yuan]Nanjing Tech Univ, Coll Mat Sci & Engn, Nanjing 210009, Peoples R China
  • [ 3 ] [Wang, Xia]Nanjing Tech Univ, Coll Mat Sci & Engn, Nanjing 210009, Peoples R China
  • [ 4 ] [Zong, Peng-an]Nanjing Tech Univ, Coll Mat Sci & Engn, Nanjing 210009, Peoples R China
  • [ 5 ] [Zhang, Peng]Beijing Univ Technol, Fac Mat & Mfg, Beijing, Peoples R China
  • [ 6 ] [Razeeb, Kafil M.]Univ Coll Cork, Tyndall Natl Inst, Micronano Syst Ctr, Cork T12 R5CP, Ireland

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Source :

INTERNATIONAL MATERIALS REVIEWS

ISSN: 0950-6608

Year: 2022

1 6 . 1

JCR@2022

1 6 . 1 0 0

JCR@2022

ESI Discipline: MATERIALS SCIENCE;

ESI HC Threshold:66

JCR Journal Grade:1

CAS Journal Grade:1

Cited Count:

WoS CC Cited Count: 7

SCOPUS Cited Count: 9

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 2

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