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Author:

Qin, F. (Qin, F..) | He, Q. (He, Q..) | Gong, Y. (Gong, Y..) | Hou, C. (Hou, C..) | Cheng, H. (Cheng, H..) | An, T. (An, T..) | Dai, Y. (Dai, Y..) | Chen, P. (Chen, P..)

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EI Scopus SCIE

Abstract:

We introduce a coupled finite and boundary element method for elastic-plastic analysis over multiscale electronic packaging structures. Based on the finite element-boundary element (FE-BE) coupling algorithm, an automatic implementation procedure for the coupling of the ABAQUS with a self-written elastic BE code is introduced for elastic problems. In the mixed finite element method (FEM)-boundary element method (BEM) model, the effective stiffness and effective forces at the interfacial boundary are evaluated by the self-written BE code. Then, the obtained effective stiffness and effective forces are assembled to the global FE formulations by using the user subroutine (UEL) in ABAQUS. Numerical simulation of structures with plastic deformation, stress concentration, etc. is carried out by using FEM theory. The boundary element method is used for linear elastic domains with large-scale structures. The proposed method offers several key improvements compared with current analysis methods available for multiscale electronic packaging structures. The benefits are: (i) the powerful pre- and postprocessing of ABAQUS; (ii) the higher accuracy of the solution; (iii) the computational cost and time can be reduced by using the scheme; and (iv) solving systems with infinite extension by using the BEM as a supplement. Furthermore, we demonstrate the ability of the proposed approach to handle multiscale structures in electronic packaging problems.  Copyright © 2022 by ASME.

Keyword:

ABAQUS coupling method elasic problems with multiscale structures finite element method boundary element method

Author Community:

  • [ 1 ] [Qin F.]Institute of Electronics Packaging Technology and Reliability, Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing, 100124, China
  • [ 2 ] [Qin F.]Beijing Key Laboratory of Advanced Manufacturing Technology, Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing, 100124, China
  • [ 3 ] [He Q.]Institute of Electronics Packaging Technology and Reliability, Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing, 100124, China
  • [ 4 ] [Gong Y.]Institute of Electronics Packaging Technology and Reliability, Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing, 100124, China
  • [ 5 ] [Gong Y.]Beijing Key Laboratory of Advanced Manufacturing Technology, Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing, 100124, China
  • [ 6 ] [Hou C.]Science and Technology on Reliability and Environment Engineering Laboratory, Beijing Institute of Structure and Environment Engineering, Beijing, 100076, China
  • [ 7 ] [Cheng H.]Science and Technology on Reliability and Environment Engineering Laboratory, Beijing Institute of Structure and Environment Engineering, Beijing, 100076, China
  • [ 8 ] [An T.]Institute of Electronics Packaging Technology and Reliability, Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing, 100124, China
  • [ 9 ] [An T.]Beijing Key Laboratory of Advanced Manufacturing Technology, Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing, 100124, China
  • [ 10 ] [Dai Y.]Institute of Electronics Packaging Technology and Reliability, Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing, 100124, China
  • [ 11 ] [Dai Y.]Beijing Key Laboratory of Advanced Manufacturing Technology, Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing, 100124, China
  • [ 12 ] [Chen P.]Institute of Electronics Packaging Technology and Reliability, Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing, 100124, China
  • [ 13 ] [Chen P.]Beijing Key Laboratory of Advanced Manufacturing Technology, Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing, 100124, China

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Source :

Journal of Electronic Packaging, Transactions of the ASME

ISSN: 1043-7398

Year: 2023

Issue: 2

Volume: 145

1 . 6 0 0

JCR@2022

ESI Discipline: ENGINEERING;

ESI HC Threshold:19

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count: 2

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 9

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