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Author:

Yan, Jia (Yan, Jia.) | Xia, Guodong (Xia, Guodong.) | Ma, Dandan (Ma, Dandan.)

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Abstract:

In this paper, water-based silver copper alloy nanofluids were prepared by liquid phase reduction method, and their absorbance, thermal conductivity and viscosity were tested. The results showed that when the injection flow rate of precursor was 0.5 mL/min, the reaction temperature was 70 and the molar ratio of surfactant polyvinylpyrrolidone (PVP) was 7, the peak absorbance of nanofluids showed the highest value; With the increase of injection flow and reaction temperature, the thermal conductivity of nanofluids increased first and then decreased. When the injection flow was 0.5 mL/min and the fluid temperature was 80, the thermal conductivity increased by 16.81%; When the reaction temperature is 70 and the fluid temperature is 40, the thermal conductivity of nanofluids is 12.16% higher than that of deionized water; The viscosity of nanofluids increases with the increase of injection flow rate. The reaction temperature has an important effect on the viscosity of nanofluids. When the reaction temperature is 80, the viscosity of the prepared nanofluids is the highest, which is 30% higher than that of deionized water at 25. © 2023, Science Press. All right reserved.

Keyword:

Molar ratio Silver alloys Nanofluidics Viscosity Copper alloys Thermal conductivity of liquids Deionized water

Author Community:

  • [ 1 ] [Yan, Jia]Key Laboratory of Enhancement Heat Transfer and Energy Conservation Ministry of Education, Department of Environment and Life, Beijing University of Technology, Beijing; 100124, China
  • [ 2 ] [Xia, Guodong]Key Laboratory of Enhancement Heat Transfer and Energy Conservation Ministry of Education, Department of Environment and Life, Beijing University of Technology, Beijing; 100124, China
  • [ 3 ] [Ma, Dandan]Key Laboratory of Enhancement Heat Transfer and Energy Conservation Ministry of Education, Department of Environment and Life, Beijing University of Technology, Beijing; 100124, China

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Source :

Journal of Engineering Thermophysics

ISSN: 0253-231X

Year: 2023

Issue: 1

Volume: 44

Page: 131-136

ESI Discipline: PHYSICS;

ESI HC Threshold:17

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 8

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