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Author:

Hu, Z. (Hu, Z..) | Wang, Y. (Wang, Y..) | Feng, K. (Feng, K..) | Chu, Z. (Chu, Z..) | Cui, J. (Cui, J..) | Sun, F. (Sun, F..)

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EI Scopus SCIE

Abstract:

Model-based compensators have been widely applied in force sensors with soft materials to eliminate viscoelasticity that causes creep output, slow dynamic response, and limits the performance of the sensors. However, the lack of accurate characterization of high-order viscoelasticity and the high computational complexity restricts the performance and application of existing methods. For the above problem, we propose a first-order Volterra grey box model-based viscoelastic compensator for force sensors with soft materials. First, the measurement mechanism of the soft-material-based force sensor is analyzed, and a grey box model for accurately characterizing the high-order linear viscoelasticity by the first-order Volterra series is proposed, without needing high-order spring-damping parameters and their exponential operations. Then, the high-order viscoelasticity compensator is designed and directly linearly fitted with the variation of the historical output, which avoids the computational complexity of the high-order creep compliance and its exponential parameters fitting. Finally, the proposed method is verified with a self-developed soft-material-based capacitive force sensor. The real-time experimental results show that, compared with existing methods, the proposed compensator not only has better compensation performance, but also has a shorter calculation time for force sensors with soft materials. IEEE

Keyword:

Dynamics Systems modeling Viscoelasticity Creep Compensation Load modeling Computational modeling Strain Force sensors Sensors Stress

Author Community:

  • [ 1 ] [Hu Z.]School of Instrumentation and Optoelectronic Engineering, Beihang University, Beijing, China
  • [ 2 ] [Wang Y.]School of Mechanical Engineering and Applied Electronics, Beijing University of Technology, Beijing, China
  • [ 3 ] [Feng K.]School of Mechanical Engineering and Applied Electronics, Beijing University of Technology, Beijing, China
  • [ 4 ] [Chu Z.]School of Instrumentation and Optoelectronic Engineering, Beihang University, Beijing, China
  • [ 5 ] [Cui J.]School of Mechanical Engineering and Applied Electronics, Beijing University of Technology, Beijing, China
  • [ 6 ] [Sun F.]Department of Computer Science and Technology, Tsinghua University, Beijing, China

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Source :

IEEE Transactions on Instrumentation and Measurement

ISSN: 0018-9456

Year: 2023

Volume: 72

Page: 1-1

5 . 6 0 0

JCR@2022

ESI Discipline: ENGINEERING;

ESI HC Threshold:19

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count: 3

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 6

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