SHPB tests for mechanical behavior of lead-free solder alloys - Details

Author：

Qin, Fei (Qin, Fei.) (Scholars：秦飞) | An, Tong (An, Tong.) | Chen, Na (Chen, Na.)

Indexed by：

EI Scopus

Abstract：

Dynamic　behavior　of　solder　joints　in　microelectronic　packages　is　key　issue　for　drop/impact　reliability　design　of　mobile　electronic　products.　The　dynamic　mechanical　behavior　of　63Sn37Pb,　96.5Sn3.5Ag　and　96.5Sn3.0Ag0.5Cu　at　high　strain　rates　have　been　investigated　by　using　the　split　Hopkinson　pressure/tension　bar　testing　technique　(SHPB).　Stress-strain　relations　of　the　three　solders　were　obtained　at　strain　rates　of　600s-1,　1200s-1　and　2200s　-1,　respectively.　The　experimental　results　show　that　the　lead-free　solders　are　strongly　strain　rate　dependent.　96.5Sn3.5Ag　is　the　most　sensitive　to　strain　rate,　while　63Sn37Pb　is　the　least.　96.5Sn3.0Ag0.5Cu　has　the　greatest　yield　stress　and　tensile　strength.　Relations　of　the　yield　stress　and　the　tensile　strength　of　the　solders　with　strain　rate　were　fitted.　©　2009　SPIE.

Keyword：

Product design Soldering Mechanical testing Soldered joints Silver alloys Stress-strain curves Strain rate Ternary alloys Copper alloys Tensile strength Yield stress Tin alloys Binary alloys Microelectronics Dynamics Lead-free solders

Author Community：

[ 1 ] [Qin, Fei]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China
[ 2 ] [An, Tong]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China
[ 3 ] [Chen, Na]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China

Reprint Author's Address：

Email：

qfei@bjut.edu.cn

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Related Keywords：

Dynamic behavior tests of lead-free solders at high strain rates by the SHPB technique
2008，2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008
Strain rate effect and Johnson-Cook models of lead-free solder alloys
2008，2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008
Dynamic mechanical properties of lead-free solders
2009，Journal of Beijing University of Technology
Strain rate effects and material models of solders
2010，Chinese Journal of Theoretical and Applied Mechanics

Source ：

ISSN： 0277-786X

Year： 2009

Volume： 7375

Language： English

Cited Count：

WoS CC Cited Count： 0

SCOPUS Cited Count： 1

ESI Highly Cited Papers on the List： 0 Unfold All

WanFang Cited Count：

Chinese Cited Count：

30 Days PV： 9

Affiliated Colleges：

材料科学与工程学院本学院/部未明确归属的数据

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