Reliability　of　solder　joints　in　electronic　packages　depends　on　the　mechanical　properties　of　solder　materials.　Under　drop　impact　loadings,　the　solder　joint　undergoes　high　strain　rate　deformation.　Therefore　it　is　important　to　investigate　the　effect　of　strain　rate　on　the　mechanical　behavior　of　the　solder　materials.　In　this　paper,　mechanical　properties　and　stress-strain　curves　of　one　lead-containing　solder,　Sn37Pb,　and　two　lead-free　solders,　Sn3.5Ag　and　Sn3.0Ag0.5Cu,　were　investigated　at　strain　rates　ranging　from　600s-1　to　2200　s-1　by　the　split　Hopkinson　pressure　and　tensile　bar　techniques.　Based　on　the　experimental　data　of　the　quasi-static　tensile　tests　and　the　split　Hopkinson　pressure　bar　tests,　elastic-plastic　material　models　independent　of　the　strain　rate　and　Johnson-Cook　material　models　dependent　of　the　strain　rate　of　the　three　solders　were　developed　and　employed　to　predict　mechanical　behaviors　of　solder　joints　in　a　board　level　electronic　package　under　drop　impact　loadings.　The　results　show　that　at　high　strain　rates,　the　two　lead-free　solders　are　more　sensitive　to　the　strain　rate,　and　their　tensile　strengths　are　about　1.5　times　greater　than　that　of　the　lead-containing　solder,　and　their　ductility　is　significantly　greater　than　that　of　the　lead-containing　solder.　Under　the　drop　impact,　the　solder　joints　experience　a　strain　rate　of　1000s-1,　and　the　proposed　material　models　in　Johnson-Cook　form　are　applicable　to　predict　more　realistic　stress　and　strain　than　the　elastic-plastic　models　independent　of　strain　rate.