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Author:

Dai, Y. (Dai, Y..) | Zhao, S. (Zhao, S..) | Qin, F. (Qin, F..) | An, T. (An, T..) | Gong, Y. (Gong, Y..) | Chen, P. (Chen, P..)

Indexed by:

EI Scopus

Abstract:

Enhancement of the fracture resistance for sintered silver joints has been one of the critical issues that considered frequently in engineering practice. In this paper, different micropatterned sintered silver joints were fabricated. Through end notch flexural test, the load displacement curves for various kinds of micropatterned joints are presented. The shearing fracture toughness and shearing fracture characteristics for different micropatterned joints are also given. The maximum shearing fracture toughness is obtained under the grid groove samples with the highest shearing fracture toughness obtained at 356.95 ± 27.45 J/m2, which is about 7.8 times of that without micropatterned joints. It is also found that the shearing fracture toughness is strongly dependent on the groove depth of the micropatterns. The cracking morphology shows that the crack extension was mainly in a cohesive mode but was also associated with locally interfacial debonding failure that occurred at the groove locus. Although the micropatterns lead to the increase of shearing fracture toughness of adhesively bonded joints and even some of the tested P-δ curves shows the ductile fracture manner, the macro fracture morphology of the crack in sintered silver shows that the cracking in micropatterned joints still presents brittle fracture manner. © 2023 Elsevier Ltd

Keyword:

CBBM Shearing fracture toughness ENF test Micropattern Sintered silver

Author Community:

  • [ 1 ] [Dai Y.]Institute of Electronics Packaging Technology and Reliability, Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing, 100124, China
  • [ 2 ] [Dai Y.]Beijing Key Laboratory of Advanced Manufacturing Technology, Beijing University of Technology, Beijing, 100124, China
  • [ 3 ] [Zhao S.]Institute of Electronics Packaging Technology and Reliability, Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing, 100124, China
  • [ 4 ] [Qin F.]Institute of Electronics Packaging Technology and Reliability, Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing, 100124, China
  • [ 5 ] [Qin F.]Beijing Key Laboratory of Advanced Manufacturing Technology, Beijing University of Technology, Beijing, 100124, China
  • [ 6 ] [An T.]Institute of Electronics Packaging Technology and Reliability, Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing, 100124, China
  • [ 7 ] [An T.]Beijing Key Laboratory of Advanced Manufacturing Technology, Beijing University of Technology, Beijing, 100124, China
  • [ 8 ] [Gong Y.]Institute of Electronics Packaging Technology and Reliability, Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing, 100124, China
  • [ 9 ] [Gong Y.]Beijing Key Laboratory of Advanced Manufacturing Technology, Beijing University of Technology, Beijing, 100124, China
  • [ 10 ] [Chen P.]Institute of Electronics Packaging Technology and Reliability, Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing, 100124, China
  • [ 11 ] [Chen P.]Beijing Key Laboratory of Advanced Manufacturing Technology, Beijing University of Technology, Beijing, 100124, China

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Source :

International Journal of Adhesion and Adhesives

ISSN: 0143-7496

Year: 2023

Volume: 125

ESI Discipline: MATERIALS SCIENCE;

ESI HC Threshold:26

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count: 3

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 2

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