The　advanced　5G　wireless　mobile　phones　have　pushed　surface　acoustic　wave　(SAW)　filters　quickly　developed　in　the　direction　toward　miniaturization,　high　performance　and　low　cost.　Three-dimensional　wafer-level　packaging　(3D-　WLP)　is　a　promising　solution　for　SAW　filter.　It　needs　to　be　developed　and　replace　conventional　package　technologies.　In　this　paper,　wafer　level　SAW　filter　package　is　designed　using　glass　capping　technology.　Thin　glass　with　through　glass　vias　(TGVs)　is　formed　through　laser-induced　chemical　etching.　Following,　the　prepared　glass　capping　dies　are　bonded　on　the　corresponding　SAW　filter　substrate　to　provide　a　safe　environment　for　the　device　function　area　from　corrosions.　As　compared　with　thin-film　packaging　that　will　cause　the　material　outgassing　at　high　temperatures,　resulting　in　the　contamination　of　the　IDT,　glass　capping　technology　can　avoid　those　problems.　Finite　element　simulation　model　is　built　to　calculate　stress　value　to　make　the　final　package　pass　the　reliability　test.　Our　experiments　indicated　that　the　improved　packages　pass　the　reliability　test,　such　as　pre-conditional　level　3,　temperature　cycling　test　(TCT).　©　2021　IEEE.