The　electromigration　damage　evolution　of　BGA　solder　joints　under　high　temperature　and　high　current　density　condition　was　studied.　Based　on　the　COMSOL　Multiphysics　5.5,　a　damage　recording　method　was　proposed　to　simulate　the　electro-thermal-mechanical　multi-physics　coupling　and　to　analyze　the　generation　and　expansion　of　electromigration　voids.　The　effects　of　four　kinds　of　atoms　diffusion　force　were　comprehensively　considered,　including　electron　wind,　temperature　gradient,　stress　gradient　and　atomic　concentration　gradient.　Results　show　that　the　electron　wind　force　plays　a　major　role　in　the　formation　of　the　electromigration　voids,　on　the　contrary,　the　atom　gradient　flux　inhibits　the　excessive　atom　migration.　The　ambient　temperature　affects　the　atomic　diffusion　coefficient　of　the　solder　joint,　and　the　atoms　diffusion　coefficient　is　larger　at　higher　temperatures.　When　the　ambient　temperature　is　in　the　temperature　cycle　condition,　the　stress　gradient　flux　and　the　electron　wind　flux　become　the　main　atoms　migration　force.　©　2021,　Editorial　Department　of　Journal　of　Beijing　University　of　Technology.　All　right　reserved.