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Author:

Pan, Shijie (Pan, Shijie.) | Feng, Shiwei (Feng, Shiwei.) (Scholars:冯士维) | Li, Xuan (Li, Xuan.) | Bai, Kun (Bai, Kun.) | Lu, Xiaozhuang (Lu, Xiaozhuang.) | Zheng, Xiang (Zheng, Xiang.) | Feng, Zixuan (Feng, Zixuan.) | Zhang, Yamin (Zhang, Yamin.)

Indexed by:

EI Scopus SCIE

Abstract:

In this article, a trap characterization system based on the transient drain voltage was constructed to achieve the complete measurement and analysis of traps in GaN high-electron-mobility transistors (HEMTs). Through the appropriate design of the measurement circuit and acquisition system, the transient drain voltage variations caused by trapping behaviors in the GaN HEMTs can be obtained. A time constant extraction method based on the Bayesian deconvolution function was used to optimize the trap extraction accuracy, and the trap properties, including time constant, absolute amplitudes, and energy levels, can be comprehensively characterized. In combination with the above trap features, the response of trapping behaviors to various bias voltages was obtained to analyze the trap positions. With respect to the GaN HEMTs with different processes and fabrications, extensive measurements of energy levels were performed on four kinds of samples to confirm the validity of the proposed characterization system, and four devices of each kind were used to verify the repeatability of experimental results. It indicated that the constructed instrument and measurement methods can realize the accurate and nondestructive characterization of traps. The method used in this study can be potentially beneficial to better understand the reliability issues and optimize the performance of devices.

Keyword:

GaN high-electron-mobility transistors (HEMTs) Energy level trapping effect reliability transient drain voltage

Author Community:

  • [ 1 ] [Pan, Shijie]Beijing Univ Technol, Inst Semicond Device Reliabil Phys, Beijing 100124, Peoples R China
  • [ 2 ] [Feng, Shiwei]Beijing Univ Technol, Inst Semicond Device Reliabil Phys, Beijing 100124, Peoples R China
  • [ 3 ] [Li, Xuan]Beijing Univ Technol, Inst Semicond Device Reliabil Phys, Beijing 100124, Peoples R China
  • [ 4 ] [Bai, Kun]Beijing Univ Technol, Inst Semicond Device Reliabil Phys, Beijing 100124, Peoples R China
  • [ 5 ] [Lu, Xiaozhuang]Beijing Univ Technol, Inst Semicond Device Reliabil Phys, Beijing 100124, Peoples R China
  • [ 6 ] [Zheng, Xiang]Beijing Univ Technol, Inst Semicond Device Reliabil Phys, Beijing 100124, Peoples R China
  • [ 7 ] [Feng, Zixuan]Beijing Univ Technol, Inst Semicond Device Reliabil Phys, Beijing 100124, Peoples R China
  • [ 8 ] [Zhang, Yamin]Beijing Univ Technol, Inst Semicond Device Reliabil Phys, Beijing 100124, Peoples R China
  • [ 9 ] [Li, Xuan]Chinese Acad Sci, Inst Microelect, Beijing 100029, Peoples R China
  • [ 10 ] [Zheng, Xiang]Univ Bristol, Ctr Device Thermog & Reliabil, Bristol BS8 1QU, Avon, England

Reprint Author's Address:

  • [Feng, Shiwei]Beijing Univ Technol, Inst Semicond Device Reliabil Phys, Beijing 100124, Peoples R China;;

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Source :

IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT

ISSN: 0018-9456

Year: 2024

Volume: 73

5 . 6 0 0

JCR@2022

Cited Count:

WoS CC Cited Count: 1

SCOPUS Cited Count: 1

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 5

Affiliated Colleges:

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