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Author:

Meng, Xianwei (Meng, Xianwei.) | Zhang, Meng (Zhang, Meng.) | Feng, Shiwei (Feng, Shiwei.) | Tang, Yidan (Tang, Yidan.) | Zhang, Yamin (Zhang, Yamin.)

Indexed by:

EI Scopus SCIE

Abstract:

In this article, a new online temperature measurement method for silicon carbide power metal-oxide-semiconductor field-effect transistors (mosfets) is proposed that uses the linear relationship between the drain-source current (I-ds) and the temperature of power electronic devices. The temperature-sensitive characteristics of the transfer characteristic curve of these mosfets are studied. The results show that, under different applied gate voltages, the effects of temperature on the change in the I-ds are different; under the same gate voltage, the drain-source current of each device maintains a good linear relationship with the temperature, which can be used to perform the accurate junction temperature measurements of power mosfets. Based on this characteristic, by superimposing a pulse on the gate, characterizing the instantaneous current produced by this superimposed pulse, and combining this characteristic with the relationship between the I-ds change and temperature, detection of the device's operating temperature under actual working conditions is realized. Furthermore, a related circuit is designed to reduce the influence of changes in the electrical bias on the system stability during temperature measurements. In addition, the measurement results are verified via infrared thermal imaging, and the results show that the proposed method has good practicability.

Keyword:

three-phase bridge silicon carbide (SiC) metal-oxide-semiconductor field-effect transistor (MOSFET) junction temperature Drain-source current

Author Community:

  • [ 1 ] [Meng, Xianwei]Beijing Univ Technol, Inst Semicond Device Reliabil Phys, Beijing 100124, Peoples R China
  • [ 2 ] [Zhang, Meng]Beijing Univ Technol, Inst Semicond Device Reliabil Phys, Beijing 100124, Peoples R China
  • [ 3 ] [Feng, Shiwei]Beijing Univ Technol, Inst Semicond Device Reliabil Phys, Beijing 100124, Peoples R China
  • [ 4 ] [Zhang, Yamin]Beijing Univ Technol, Inst Semicond Device Reliabil Phys, Beijing 100124, Peoples R China
  • [ 5 ] [Tang, Yidan]Chinese Acad Sci, Inst Microelect, Beijing 100029, Peoples R China

Reprint Author's Address:

  • [Zhang, Yamin]Beijing Univ Technol, Inst Semicond Device Reliabil Phys, Beijing 100124, Peoples R China

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Source :

IEEE TRANSACTIONS ON POWER ELECTRONICS

ISSN: 0885-8993

Year: 2024

Issue: 4

Volume: 39

Page: 4714-4724

6 . 7 0 0

JCR@2022

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 0

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