• Complex
  • Title
  • Keyword
  • Abstract
  • Scholars
  • Journal
  • ISSN
  • Conference
搜索

Author:

Ge, Jinguo (Ge, Jinguo.) | Ma, Tiejun (Ma, Tiejun.) | Han, Wentao (Han, Wentao.) | Yuan, Tao (Yuan, Tao.) | Jin, Tounan (Jin, Tounan.) | Fu, Hanguang (Fu, Hanguang.) (Scholars:符寒光) | Xiao, Rongshi (Xiao, Rongshi.) (Scholars:肖荣诗) | Lei, Yongping (Lei, Yongping.) (Scholars:雷永平) | Lin, Jian (Lin, Jian.)

Indexed by:

EI Scopus SCIE

Abstract:

Both of the transient thermal transfer model and the thermal elastic-plastic model were adopted for the thermal and stress simulation during the additively manufacture of 2Cr13 thin-wall part. The microstructural evolution and internal defect distribution were also characterized, as well as the measurement of thermal cycles and residual stress. A fair agreement between the simulated and experimental results, including the thermal cycling curves and residual stress distribution, was achieved. During the arc deposition, the spatially transient stress distribution was evolved regularly as a consequence of the repeated transient thermal history, which finally transformed into the residual stress within the whole part and caused the wrapping phenomenon. In the middle region, the location-related metal-stable microstructure and nonhomogeneous micro-sized pore distribution was obtained within a single layer, supposedly a result of complicated in-situ micro-heating treatment when new layers continuously deposited on the top of the buildup. However, the whole top-most layer was featured by the homogenous microstructure and pore distribution, as this area didn't undergo the further in-situ thermal cycle. The intrinsic relationship of "thermal history- microstructural evolution- defect distribution" was explored with the combination of numerical simulation and experimental characterization during the arc deposition of 2Cr13 part.

Keyword:

Finite element simulation 2Cr13 thin-wall part Thermal history Wire-arc additive manufacturing Defect distribution Microstructural evolution

Author Community:

  • [ 1 ] [Ge, Jinguo]Beijing Univ Technol, Sch Mat Sci & Engn, Beijing 100124, Peoples R China
  • [ 2 ] [Ma, Tiejun]Beijing Univ Technol, Sch Mat Sci & Engn, Beijing 100124, Peoples R China
  • [ 3 ] [Han, Wentao]Beijing Univ Technol, Sch Mat Sci & Engn, Beijing 100124, Peoples R China
  • [ 4 ] [Yuan, Tao]Beijing Univ Technol, Sch Mat Sci & Engn, Beijing 100124, Peoples R China
  • [ 5 ] [Jin, Tounan]Beijing Univ Technol, Sch Mat Sci & Engn, Beijing 100124, Peoples R China
  • [ 6 ] [Fu, Hanguang]Beijing Univ Technol, Sch Mat Sci & Engn, Beijing 100124, Peoples R China
  • [ 7 ] [Lei, Yongping]Beijing Univ Technol, Sch Mat Sci & Engn, Beijing 100124, Peoples R China
  • [ 8 ] [Lin, Jian]Beijing Univ Technol, Sch Mat Sci & Engn, Beijing 100124, Peoples R China
  • [ 9 ] [Xiao, Rongshi]Beijing Univ Technol, Inst Laser Engn, Beijing 100124, Peoples R China

Reprint Author's Address:

  • 雷永平

    [Lei, Yongping]100 Pingle Garden, Beijing 100124, Peoples R China;;[Lin, Jian]100 Pingle Garden, Beijing 100124, Peoples R China

Show more details

Related Keywords:

Source :

APPLIED THERMAL ENGINEERING

ISSN: 1359-4311

Year: 2019

Volume: 163

6 . 4 0 0

JCR@2022

ESI Discipline: ENGINEERING;

ESI HC Threshold:136

JCR Journal Grade:1

Cited Count:

WoS CC Cited Count: 29

SCOPUS Cited Count: 35

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 6

Online/Total:461/10617021
Address:BJUT Library(100 Pingleyuan,Chaoyang District,Beijing 100124, China Post Code:100124) Contact Us:010-67392185
Copyright:BJUT Library Technical Support:Beijing Aegean Software Co., Ltd.