To　achieve　high-density,　high-reliability　integrated　packaging　interconnects,　3D　packaging　technology　has　become　a　focus　of　current　research,　where　Through-Silicon　Via　(TSV)　and　Through-Glass　Via　(TGV)　technologies　are　key　interconnect　technologies.　However,　in　TSV　and　TGV　structures,　the　mismatch　in　thermal　expansion　coefficients　among　various　materials　and　the　complexity　of　the　interconnect　structures　can　lead　to　significant　thermal　stress　during　production　and　use,　severely　affecting　device　performance　and　reliability.　In　this　study,　a　thermomechanically　coupled　phase-field　model　that　considers　mixed-mode　fracture　is　proposed　to　study　the　mechanical　performance　and　fracture　behavior　of　interconnect　structures.　The　approach　to　studying　coupled　thermo-mechanical-damage　models　can　indeed　be　divided　into　two　parts,　focusing　first　on　microstructure　generation　using　Voronoi　polygons　and　second　on　conducting　phase　field　simulations　to　analyze　mechanical　and　fracture　behaviors.　The　framework　was　applied　to　model　the　fracture　of　interconnect　structures　under　thermal　cyclic　conditions,　demonstrating　the　formation　of　distinctive　crack　patterns　and　complex　crack　networks.　The　cracking　behaviors　observed　in　the　experiments　and　simulations　are　remarkably　similar　to　each　other.　This　research　provides　an　efficient　and　reliable　simulation　method　for　enhancing　the　reliability　of　interconnect　structures　in　3D　packaging　technology.