Nano-Ag　paste　is　a　popular　material　in　power　electronic　packaging,　while　its　microstructure　is　unstable　at　high　temperatures　and　suffers　from　electrochemical　migration.　In　this　work,　Ag-Pd　nanoalloy　film　has　been　prepared　by　the　pulsed　laser　deposition,　and　been　sintered　at　low　temperature　for　packaging.　The　thermal　stability　is　significantly　improved　at　300　degrees　C　when　Ag　is　alloyed　with　Pd.　The　Pd　addition　significantly　increased　the　diffusion　activation　energy　of　Ag　atoms　and　reduced　the　diffusion　coefficient.　The　Ag-Pd　sintered　layer　exhibited　a　stable　microstructure　at　300　degrees　C　or　even　500　degrees　C,　which　indicated　that　Ag-Pd　nanoalloy　had　the　potential　to　serve　at　high　temperatures.　Ag-Pd　nanoalloy　will　preferentially　generate　a　PdO　passivation　film　and　cover　the　anode　surface,　thereby　slowing　down　the　dissolution　of　the　Ag　and　improving　its　resistance　to　electrochemical　migration.　This　work　provides　theoretical　studies　and　insights　into　the　applications　of　Ag-Pd　nanoalloys　in　high-reliability　power　electronics.