• Complex
  • Title
  • Keyword
  • Abstract
  • Scholars
  • Journal
  • ISSN
  • Conference
搜索

Author:

Liu, Xingyu (Liu, Xingyu.) | Dai, Yanwei (Dai, Yanwei.) | Kang, Rong (Kang, Rong.) | Zhao, Libo (Zhao, Libo.) | Qin, Fei (Qin, Fei.)

Indexed by:

CPCI-S EI Scopus

Abstract:

This paper utilizes the cohesive zone model (CZM) and method of numerical computation to conduct inverse analysis, leveraging the existing experimental results of Single-Leg Bending(SLB) tests of sintered silver joints with different metallization layers. Based on experimental data, numerical inverse analysis was conducted to determine the cohesive zone model (CZM) parameters for sintered silver joints with varying metallization layers. Initially, curves of load and displacement (P-delta) are directly obtained from the SLB tests. Subsequently, by analyzing these experimental data, the interfacial fracture toughness of the sintered silver joints with different metallization layers is determined. A two-dimensional finite element model (FEM) for the three-point bending of an SLB sample is developed. Ultimately, the cohesive zone model of the sintered silver joints with different metallization layers is established. The research findings demonstrate that the interfacial fracture toughness is highest when the metallization layer is Ni/Ag. The results suggest that the numerical solutions are in good agreement with the experimental data.

Keyword:

Cohesive zone model(CZM) metallization layers Sintered silver Numerical simulation

Author Community:

  • [ 1 ] [Liu, Xingyu]Beijing Univ Technol, Inst Elect Packaging Technol & Reliabil, Dept Mech, Beijing, Peoples R China
  • [ 2 ] [Dai, Yanwei]Beijing Univ Technol, Inst Elect Packaging Technol & Reliabil, Dept Mech, Beijing, Peoples R China
  • [ 3 ] [Kang, Rong]Beijing Univ Technol, Inst Elect Packaging Technol & Reliabil, Dept Mech, Beijing, Peoples R China
  • [ 4 ] [Zhao, Libo]Beijing Univ Technol, Inst Elect Packaging Technol & Reliabil, Dept Mech, Beijing, Peoples R China
  • [ 5 ] [Qin, Fei]Beijing Univ Technol, Inst Elect Packaging Technol & Reliabil, Dept Mech, Beijing, Peoples R China

Reprint Author's Address:

  • [Dai, Yanwei]Beijing Univ Technol, Inst Elect Packaging Technol & Reliabil, Dept Mech, Beijing, Peoples R China

Show more details

Related Keywords:

Source :

2024 25TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT

ISSN: 2836-9734

Year: 2024

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 1

Affiliated Colleges:

Online/Total:538/10835438
Address:BJUT Library(100 Pingleyuan,Chaoyang District,Beijing 100124, China Post Code:100124) Contact Us:010-67392185
Copyright:BJUT Library Technical Support:Beijing Aegean Software Co., Ltd.