Tensile　properties　and　fracture　mechanism　of　Sn3.0Ag0.5Cu/Cu　solder　joints　aged　at　150°C　for　different　time　were　investigated　at　the　strain　rates　of　2　×　10-4,　2　×　10-2　and　2　s-1.　Experimental　results　show　that　the　strain　rate　plays　a　significant　role　in　the　strength　and　the　fracture　behavior　of　the　solder　joints.　The　tensile　strength　of　the　solder　joints　increases　with　increasing　of　strain　rate.　The　solder　joints　fail　in　a　ductile　mode　within　the　solder　at　the　low　strain　rate,　but　fail　in　a　brittle　mode　inside　the　IMC　layer　at　the　high　strain　rate.