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Author:

Huang, Ling-Yan (Huang, Ling-Yan.) | Liu, Zhong-Liang (Liu, Zhong-Liang.) (Scholars:刘中良) | Gou, Yu-Jun (Gou, Yu-Jun.) | Liu, Yao-Min (Liu, Yao-Min.)

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EI Scopus PKU CSCD

Abstract:

A series of hydrophobic surfaces with different contact angles were fabricated by chemical etching and fluorination modification, the largest water contact angle was measured to be 155.2°. Comparative micro-observations of the water droplets formation, freezing process and frost crystals growth were carried out on both the hydrophobic surfaces and the plain copper surface under the same conditions. The experimental results showed that the water droplets condensed on the hydrophobic were smaller and present a more spherical shape when compared with that on the plain copper surface. The freezing time of the droplets on the hydrophobic surface was later than that on the plain copper surface. Moreover, the frost crystals formed on the hydrophobic surface were sparse and can thaw quickly. The mechanism of surface hydrophobicity influence on droplets frozen and frost formation was analyzed theoretically based on the phase transition theory.

Keyword:

Contact angle Freezing Surface chemistry Etching Chemical modification Copper Hydrophobicity Drop formation

Author Community:

  • [ 1 ] [Huang, Ling-Yan]Key Laboratory of Enhanced Heat Transfer and Energy Conservation of Ministry of Education, Beijing University of Technology, Beijing 100124, China
  • [ 2 ] [Liu, Zhong-Liang]Key Laboratory of Enhanced Heat Transfer and Energy Conservation of Ministry of Education, Beijing University of Technology, Beijing 100124, China
  • [ 3 ] [Gou, Yu-Jun]Key Laboratory of Enhanced Heat Transfer and Energy Conservation of Ministry of Education, Beijing University of Technology, Beijing 100124, China
  • [ 4 ] [Gou, Yu-Jun]Tangshan University, Tangshan 06300, China
  • [ 5 ] [Liu, Yao-Min]Key Laboratory of Enhanced Heat Transfer and Energy Conservation of Ministry of Education, Beijing University of Technology, Beijing 100124, China

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Source :

Journal of Engineering Thermophysics

ISSN: 0253-231X

Year: 2011

Issue: 3

Volume: 32

Page: 473-476

ESI Discipline: PHYSICS;

JCR Journal Grade:4

CAS Journal Grade:4

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 6

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