Tension-tension fatigue properties and life prediction of electroplated copper films - Details

Author：

Liu, Hao (Liu, Hao.) | Shang, Deguang (Shang, Deguang.) (Scholars：尚德广) | Ma, Xinping (Ma, Xinping.) | Sun, Guoqin (Sun, Guoqin.) (Scholars：孙国芹) | Li, Desheng (Li, Desheng.) (Scholars：李德胜)

Indexed by：

EI Scopus PKU CSCD

Abstract：

Tensile　fatigue　properties　of　notched　and　smooth　specimens　for　free-standing　electroplated　copper　films　with　11.5　μm　thickness　are　studied.　The　tests　are　completed　by　using　MMT-11N　micro　mechanical　fatigue　testing　system.　The　specimens　are　fabricated　with　LIGA-like　technology.　The　tests　are　carried　out　at　room　temperature　under　tension-tension　cyclic　loading　with　20　Hz　load　frequency.　S-N　curve,　cyclic　(-N　curve　and　(-N　curve　are　obtained.　Based　on　the　modified　local　stress-strain　approach,　fatigue　lives　of　notched　specimens　are　predicted.　The　results　agree　well　with　the　experimental　fatigue　lives.　It　proves　that　the　hysteresis　loop　on　half　of　the　life　cycle　can　be　still　used　as　stable　hysteresis　loop　in　micro　mechanical　fatigue,　and　the　local　stress-strain　approach　can　be　applied　in　life　prediction　of　MEMS　fatigue,　thus　the　traditional　fatigue　research　methods　are　also　suitable　for　description　of　MEMS　fatigue　in　a　certain　extent.

Keyword：

Fatigue of materials Hysteresis Life cycle Hysteresis loops Fatigue testing Forecasting Metallic films Copper

Author Community：

[ 1 ] [Liu, Hao]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China
[ 2 ] [Shang, Deguang]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China
[ 3 ] [Ma, Xinping]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China
[ 4 ] [Sun, Guoqin]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China
[ 5 ] [Li, Desheng]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China