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Abstract：
Concept of lead-free composite solder was introduced in view of lead-free trend and soldering reliability. The developing situation of lead-free composite solder was indicated. Research on materials preparation, microstructure and properties ware emphasized. Main problems existed in present investigation was pointed out and the development prospect was discussed.
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Journal of Functional Materials
ISSN： 1001-9731
Year： 2006
Issue： SUPPL.
Volume： 37
Page： 823-826
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SCOPUS Cited Count：
ESI Highly Cited Papers on the List： 0 Unfold All
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30 Days PV： 12
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