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Author:

Fan, Xing (Fan, Xing.) | Guo, Weiling (Guo, Weiling.) (Scholars:郭伟玲) | Sun, Jie (Sun, Jie.)

Indexed by:

EI Scopus SCIE

Abstract:

Reliability is important in evaluating semiconductor device quality, although reliability measurement and analysis procedures are complicated. A new type of light-emitting diode (LED), GaN high-voltage (HV) LEDs, is superior to traditional low-voltage LEDs owing to fundamentally higher lighting efficiency and a simpler driving circuit. Recently, HV-LEDs have received much interest, and related commercial devices have been developed. However, reports on HV-LED reliability are very rare. Therefore, herein, we conduct a systematic study of the reliability of commercial HV-LEDs. In current stress-accelerated lifetime testing experiments on HV-LEDs (50 V) for 2,000 h, the luminous flux of white LEDs was reduced by 2.5%-9% and the luminous efficacy by 2.7%-11.3% after aging. The forward voltage was increased, the blue-and yellow-light irradiations of white-light HV-LEDs were reduced, and the excitation efficiency of fluorescence powders was decreased. Detailed analysis is carried out on a sample exhibiting catastrophic failure. The abrupt drop in luminous flux noted can be attributed to cracking of the fluorescent layer and reduction of optical transmittance in the epoxy resin, rather than deterioration in the chip itself. Finally, an improved lifetime-prediction method based on Bayesian statistics is proposed. Compared to conventional lifetime-calculation methods, this method combines experimental data, the conventional model, and historical information rationally. Therefore, it provides lifetime prediction at a higher confidence level: the HV-LED lifetime is estimated as 18 517 h. The results reported can guide the design, manufacturing, and packaging of HV-LEDs, while the new lifetime-estimation method is valuable to reliability evaluation of power electronic devices in the semiconductor industry.

Keyword:

HV-LED failure analysis Bayesian estimation accelerated lifetime test GaN

Author Community:

  • [ 1 ] [Fan, Xing]Beijing Univ Technol, Coll Microelect, Key Lab Optoelect Technol, Beijing 100124, Peoples R China
  • [ 2 ] [Guo, Weiling]Beijing Univ Technol, Coll Microelect, Key Lab Optoelect Technol, Beijing 100124, Peoples R China
  • [ 3 ] [Sun, Jie]Fuzhou Univ, Natl & Local United Engn Lab Flat Panel Display T, Fuzhou 350116, Fujian, Peoples R China

Reprint Author's Address:

  • 郭伟玲 孙捷

    [Guo, Weiling]Beijing Univ Technol, Coll Microelect, Key Lab Optoelect Technol, Beijing 100124, Peoples R China;;[Sun, Jie]Fuzhou Univ, Natl & Local United Engn Lab Flat Panel Display T, Fuzhou 350116, Fujian, Peoples R China

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Source :

IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY

ISSN: 1530-4388

Year: 2019

Issue: 2

Volume: 19

Page: 402-408

2 . 0 0 0

JCR@2022

ESI Discipline: ENGINEERING;

ESI HC Threshold:136

JCR Journal Grade:3

Cited Count:

WoS CC Cited Count: 8

SCOPUS Cited Count: 11

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 7

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