Rotating　grinding　is　the　most　commonly　used　technique　in　silicon　wafer　thinning,　while　it　will　induce　edge　chipping　as　wafer　thickness　decrease.　This　will　lead　to　wafer　breakage,　and　thus　resulting　in　cost　waste.　This　study　investigates　edge　chipping　of　silicon　wafers　in　rotating　grinding.　The　study　correlates　edge　chipping　with　grinding　process　parameters,　such　as　wheel　rotation　speed,　wafer　rotation　speed　and　wheel　feed　rate,　as　well　as　the　crystallographic　orientations　and　thickness　of　silicon　wafer.　It　identifies　the　relationship　between　the　edge　chipping　and　the　grinding　parameters,　crystallographic　orientations　and　wafer　thickness　respectively.　In　addition,　this　study　discusses　the　mechanisms　of　edge　chipping　based　on　machining　mechanics.　©　2016　IEEE.