Steady-state thermal simulation of ICS based on SKILL language and finite element method - Details

Author：

Bin, Zhang (Bin, Zhang.) | Shiwei, Feng (Shiwei, Feng.) (Scholars：冯士维) | Rong, Su (Rong, Su.) | Guangchen, Zhang (Guangchen, Zhang.)

Indexed by：

EI Scopus

Abstract：

In　this　paper,　a　new　method　which　combines　SKILL　language　with　finite　element　method　is　presented.　The　analysis　of　steady-state　thermal　simulation　of　analog　circuit　designed　by　Cadence　design　software　is　made　by　this　method.　Electronic　parameters　and　equivalent　thermal　resistances　of　devices　can　be　obtained　by　Cadence　circuit　simulation　software　and　finite　element　analysis　software-ANSYS.　Then　the　temperature　rise　of　the　device　in　circuit　can　be　calculated.　Combining　location　message　obtained　by　SKILL　program　with　the　temperature　rise　of　device,　temperature　distribution　graph　is　found.　Finally　the　result　is　verified　by　a　complete　ANSYS　analysis.　©　2010　IEEE.

Keyword：

Temperature distribution Heat resistance Circuit simulation Computer simulation languages Finite element method Integrated circuits Computer software

Author Community：

[ 1 ] [Bin, Zhang]College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing, China
[ 2 ] [Shiwei, Feng]College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing, China
[ 3 ] [Rong, Su]College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing, China
[ 4 ] [Guangchen, Zhang]College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing, China

Reprint Author's Address：

Email：

zhangbin1984925@yahoo.com.cn

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Related Keywords：

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Source ：

Year： 2010

Volume： 7

Page： V7285-V7288

Language： English

Cited Count：

WoS CC Cited Count：

SCOPUS Cited Count： 1

ESI Highly Cited Papers on the List： 0 Unfold All

WanFang Cited Count：

Chinese Cited Count：

30 Days PV： 1

Affiliated Colleges：

信息科学技术学院本学院/部未明确归属的数据

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