Thermal analysis of ICS based on equivalent thermal resistance and skill language - Details

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EI Scopus

Abstract：

The　thermal　analysis　of　ICs　has　been　studied　in　different　methods　for　years.　In　this　paper,　a　new　method　to　analyze　the　steady-state　temperature　distribution　of　integrated　circuit　is　presented.　According　to　equivalent　thermal　resistance　formula　obtaining　by　an　aid　tool　ANSYS　and　programming　idea,　the　temperature　distribution　graph　of　an　analog　integrated　circuit　is　obtained.　And　the　result　is　verified　by　a　complete　ANSYS　analysis.　©2009　IEEE.

Keyword：

Thermoanalysis Temperature distribution Failure analysis Analog integrated circuits Failure (mechanical)

Author Community：

[ 1 ] [Zhang, Bin]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100124, China
[ 2 ] [Su, Rong]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100124, China
[ 3 ] [Feng, Shiwei]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100124, China
[ 4 ] [Zhang, Guangchen]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100124, China
[ 5 ] [Guo, Chunsheng]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100124, China
[ 6 ] [Liu, Yin]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100124, China
[ 7 ] [Ding, Kaikai]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100124, China

Reprint Author's Address：

Email：

shwfeng@bjut.edu.cn

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Related Keywords：

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Source ：

Year： 2009

Page： 538-540

Language： English

Cited Count：

WoS CC Cited Count： 0

SCOPUS Cited Count：

ESI Highly Cited Papers on the List： 0 Unfold All

WanFang Cited Count：

Chinese Cited Count：

30 Days PV： 7

Affiliated Colleges：

信息科学技术学院本学院/部未明确归属的数据

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