Thermal analysis of DC/DC module - Details - 北京工业大学机构库

Author：

Indexed by：

EI Scopus

Abstract：

Ever-increasing　DC/DC　power　density　and　peak　temperature　challenge　its　reliability　and　performance.　Thermal　simulation　and　analysis　playa　significant　role　in　development　of　new　generation　of　DC/DC　package　design.　This　paper　presents　an　accurate　and　fast　approach　to　simulate　the　thermal　distribution　of　a　DC/DC　module.　The　thermal　distribution　is　simulated　with　ANSYS,　and　verified　by　infrared　thermal　images.　This　made　feasible　the　thermal　design　to　reduce　stressing　temperature　peaks,　so　improving　DC/DC　reliability　significantly.　©　2009　IEEE.

Keyword：

Thermoanalysis Outages Failure (mechanical) Integrated circuits Failure analysis

Author Community：

[ 1 ] [Yuanchun, Wang]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100124, China
[ 2 ] [Weidong, Ma]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100124, China
[ 3 ] [Changzhi, Lv]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100124, China
[ 4 ] [Zhiguo, Li]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100124, China
[ 5 ] [Chunsheng, Guo]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100124, China
[ 6 ] [Fei, Li]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100124, China

Reprint Author's Address：

Email：

wych@emails.bjut.edu.cn

Show more details

Related Keywords：

Thermal analysis of ICS based on equivalent thermal resistance and skill language
2009，2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2009
Thermal analysis of ICs based on equivalent thermal resistance
2008，2008 9th International Conference on Solid-State and Integrated-Circuit Technology, ICSICT 2008
A method of thermal analysis for CMOS integrated circuit
2006，ICSICT-2006: 2006 8th International Conference on Solid-State and Integrated Circuit Technology
Thermal analysis and thermal optimization of through silicon via in 3D IC
2014，2014 12th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2014

Source ：

Year： 2009

Page： 410-413

Language： English

Cited Count：

WoS CC Cited Count：

SCOPUS Cited Count： 2

ESI Highly Cited Papers on the List： 0 Unfold All

WanFang Cited Count：

Chinese Cited Count：

30 Days PV： 7

Affiliated Colleges：

信息科学技术学院本学院/部未明确归属的数据

Get Fulltext

DOI Library Discovery Baidu Scholar Search Engineering Village

Type
Departments

All Years Choose Year From to