A method of thermal analysis for CMOS integrated circuit - Details

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Indexed by：

EI Scopus

Abstract：

The　paper　presents　a　method　for　thermal　analysis　of　integrated　circuit,　which　combines　a　spice　tool　(Hspice)　with　a　finite　element　analysis　tool　(ANSYS).　Since　the　connection　between　the　two　simulators　is　not　so　smooth,　LinkCAD　for　ANSYS　that　provides　seamless　integration　of　the　ANSYS　products　with　the　CAD　environment　is　used　in　our　work.　By　this　method,　thermal　analysis　of　a　general　integrated　circuit　is　accurately　presented　with　the　consideration　of　key　sources　of　power　dissipation　and　their　temperature　relation　in　CMOS　IC.　©　2006　IEEE.

Keyword：

Circuit simulation Electric losses Finite element method CMOS integrated circuits Electric power utilization SPICE Thermoanalysis

Author Community：

[ 1 ] [Sun, Jingying]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100022, China
[ 2 ] [Feng, Shiwei]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100022, China
[ 3 ] [Meng, Hao]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100022, China
[ 4 ] [Zhang, Yuezong]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100022, China
[ 5 ] [Liu, Jing]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100022, China
[ 6 ] [Liu, Cheng]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100022, China

Reprint Author's Address：

Email：

shwfeng@bjut.edu.cn

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Source ：

Year： 2006

Page： 1462-1464

Language： English

Cited Count：

WoS CC Cited Count：

SCOPUS Cited Count： 4

ESI Highly Cited Papers on the List： 0 Unfold All

WanFang Cited Count：

Chinese Cited Count：

30 Days PV： 4

Affiliated Colleges：

信息科学技术学院本学院/部未明确归属的数据

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