Thermal analysis of the multi-chip vertical packaged white LED - Details

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EI Scopus

Abstract：

In　this　paper,　thermal　management　of　the　multi-chip　vertical　packaged　(MCVP)　white　LED　is　presented.　The　steady　state　thermal　resistance　(RT)　and　thermal　resistance　constitution　is　obtained　by　transient　response　testing　based　on　electrical　method.　RT　is　10.37C　/W.　The　chips　and　package　body　contributes　2.63C　/W　and　7.74　/W　respectively.　The　temperature　distribution　of　the　MCVP　LED　is　obtained　by　3-dimensional　finite　element　method　(FEM)　simulation.　By　comparing　heating　response　curves　among　different　package　forms＇　LED　samples,　the　MCVP　sample　shares　lowest　steady　state　temperature　rise　with　the　metal　alloyed　substrate　sample,　which　is　lower　than　18.3　of　the　single　flip-chip　sub-mounted　device　(SMD)　sample　and　15.3　of　the　multi-chip　horizontal　packaged　(MCHP)　sample.　©2009　IEEE.

Keyword：

Microprocessor chips Thermoanalysis Photonics Transient analysis Light emitting diodes Reliability Flip chip devices Heat resistance

Author Community：

[ 1 ] [Guangchen, Zhang]School of Electronic Information and Control Engineering, Beijing University of Technology, 100124 Beijing, China
[ 2 ] [Shiwei, Feng]School of Electronic Information and Control Engineering, Beijing University of Technology, 100124 Beijing, China
[ 3 ] [Lu, Wang]School of Electronic Information and Control Engineering, Beijing University of Technology, 100124 Beijing, China
[ 4 ] [Chunsheng, Guo]School of Electronic Information and Control Engineering, Beijing University of Technology, 100124 Beijing, China
[ 5 ] [Xuesong, Xie]School of Electronic Information and Control Engineering, Beijing University of Technology, 100124 Beijing, China
[ 6 ] [Chenning, Ge]School of Electronic Information and Control Engineering, Beijing University of Technology, 100124 Beijing, China