Effect of ramp rate on microstructure and properties of thermomechanically-fatigued Sn-3.5Ag based composite solder joints - Details

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EI Scopus

Abstract：

Solder　joints　experience　repeated　reverse　thermal　stress　in　service,　caused　by　the　mismatch　in　the　coefficient　of　thermal　expansion　(CTE)　between　solder　and　Cu　substrate.　Lead-free　composite　solder　was　fabricated　by　mechanically　mixing　Sn-3.5Ag　solder　paste　with　Cu　reinforcement　particles　to　improve　service　capability　of　the　base　solder　alloy.　Thermomechanical　fatigue　(TMF)　tests　were　carried　out　in　environmental　chambers.　Two　temperature　profiles,　with　the　same　extreme　temperature　of　-40°C　to　125°C　and　a　10-minute　dwell　time　at　temperature　extremes,　were　applied　in　the　tests.　One　was　a　5-minute　ramp　time　and　another　was　a　20-minute　ramp　time.　Microstructural　characteristics　and　residual　mechanical　strengths　of　the　solder　joints　were　investigated　after　0,　100,　250　and　500　TMF　cycles.　Composite　solder　joints　showed　better　TMF　performance　than　the　Sn-3.5Ag　eutectic　solder　joints.　The　results　proved　that　ramp　rate　was　one　of　the　key　issues　for　the　damages　in　solder　joints.　©　2006　IEEE.

Keyword：

Soldered joints Thermal expansion Thermomechanical treatment Environmental chambers Fatigue of materials Microstructure Tin alloys

Author Community：

[ 1 ] [Liu, Peng]Beijing University of Technology, 100 Ping Le Yuan, Chaoyang Distinct, Beijing, 100022, China
[ 2 ] [Gao, Yuan]Beijing University of Technology, 100 Ping Le Yuan, Chaoyang Distinct, Beijing, 100022, China
[ 3 ] [Cao, Qian]Beijing University of Technology, 100 Ping Le Yuan, Chaoyang Distinct, Beijing, 100022, China
[ 4 ] [Xia, Zhidong]Beijing University of Technology, 100 Ping Le Yuan, Chaoyang Distinct, Beijing, 100022, China
[ 5 ] [Lei, Yongping]Beijing University of Technology, 100 Ping Le Yuan, Chaoyang Distinct, Beijing, 100022, China
[ 6 ] [Guo, Fu]Beijing University of Technology, 100 Ping Le Yuan, Chaoyang Distinct, Beijing, 100022, China