In　the　present　work,　solidification　cracks　in　Sn-Ag-Cu　solder　joints　were　investigated.　Experimental　results　indicate　that　solidification　cracks　existed　in　significant　numbers　in　the　miniature　Sn-Ag-Cu　solder　joints.　In　order　to　create　solidification　cracks　in　the　miniature　solder　joints　during　solidification　and　evaluate　the　susceptibility　of　Sn-Ag-Cu　alloys　to　solidification　cracking,　a　copper　self-restraint　specimen　was　designed,　which　can　simulate　the　process　of　solidification　crack　formation.　The　solidification　crack　susceptibility　of　the　Sn-Ag-Cu　solder　alloy　was　evaluated　using　the　total　crack　length　of　the　solder　joint.　In　addition,　the　effect　of　trace　amounts　of　elemental　additions　on　solidification　cracking　of　Sn-Ag-Cu　solder　joints　was　studied.　It　was　found　that　adding　trace　amounts　of　Ni　or　Ce　could　depress　the　solidification　cracks　in　Sn-3.0Ag-0.5Cu　solder　joints.　However,　P　additions　aggravated　the　formation　of　solidification　cracks.