In　the　present　work,　the　effect　of　Ag　content　on　solidification　cracking　susceptibility　of　Sn-Ag-Cu　solder　joints　has　been　investigated.　Solders　containing　1.0　wt.%　to　3.8　wt.%　Ag　were　used　in　the　experiment.　Solidification　cracks　were　created　using　a　copper　self-restraint　specimen,　which　could　simulate　the　process　of　solidification　cracking.　Meanwhile,　solidification　cracking　susceptibility　was　evaluated　by　comparing　the　total　crack　length　of　the　solder　joint.　The　results　indicate　that　solidification　cracks　exist　in　solder　joints　with　1.0　wt.%　to　3.0　wt.%　Ag　content,　whereas　there　are　no　cracks　in　Sn-3.8Ag-0.7Cu　solder　joints.　When　the　Ag　content　increases　from　1.0　wt.%　to　3.0　wt.%,　the　total　crack　length　of　Sn-Ag-Cu　solder　joints　increases　to　a　maximum　and　then　drops　to　zero　when　the　Ag　content　reaches　3.8　wt.%.　In　addition,　the　susceptibility　to　solidification　cracking　is　observed　as　follows:　SAC207　＞　SAC305　＞　SAC107　＞　SAC387.