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Author:

仲伟旭 (仲伟旭.) | 武伟 (武伟.) | 秦飞 (秦飞.) (Scholars:秦飞)

Abstract:

  焊料和焊盘在界面处化学反应生成的金属问化合物(IMC)与焊锡接点破坏密切相关,因此,IMC的力学性能已经成为许多学者研究的热点。由于尺寸较小,-般的实验方法无法测试其力学性能,本文采用纳米压痕方法测量金属问化合物的弹性和模量。

Keyword:

Cu6Sn5 金属间化合物 纳米压痕方法 力学性能

Author Community:

  • [ 1 ] [仲伟旭]北京工业大学
  • [ 2 ] [武伟]北京工业大学
  • [ 3 ] [秦飞]北京工业大学

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Source :

Year: 2011

Page: 264-265

Language: Chinese

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count: -1

Chinese Cited Count:

30 Days PV: 9

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